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HCPL-2730SD

Onsemi

HCPL-2730SD by Onsemi

HCPL-2730SD by Onsemi is a 2-channel logic IC output optocoupler with separate configuration. It offers a min current transfer ratio of 300%, max isolation voltage of 2500V, and operates b/w -40 to 85°C. Ideal for applications requiring surface mounting feature and high forward current capability up to 0.06A.

Median Price

$1.240

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Arrow

USA . 298 parts In-Stock

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$0.828

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Adafruit Industries

USA . 2,000 parts In-Stock

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$0.865

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$0.787

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$0.709

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2,000

$0.865

$0.787

$0.709

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Chip1Stop

Japan . 486 parts In-Stock

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$1.240

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486

$1.240

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Rochester

USA . 1,000 parts In-Stock

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$1.660

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$1.560

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$1.410

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$1.660

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DigiKey

USA . 42 parts In-Stock

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$2.700

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Verical

USA . 298 parts In-Stock

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Digiode

USA . 3,297 parts In-Stock

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$0.787

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Nova Conductors

Japan . 160 parts In-Stock

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$1.229

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Vyrian

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

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$0.277

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$0.277

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Ampacity Inc.

Singapore . 854 parts In-Stock

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$0.700

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854

$0.700

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Semicontronic

India . 258 parts In-Stock

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$0.700

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$0.682

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$0.679

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258

$0.700

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$0.679

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Corphita

USA . 1,339 parts In-Stock

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$0.745

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$0.745

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Corohmni

South Africa . 365 parts In-Stock

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$0.828

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Continental Prestige Electronics

USA . 8,280 parts In-Stock

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$1.229

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$1.204

8,280

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$1.204

Argo Parts USA

USA . 3,715 parts In-Stock

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$1.229

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Netroflash

USA . 50 parts In-Stock

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$1.229

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$1.168

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$1.143

50

$1.229

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$1.143

Bastille Electronics

Australia . 1,842 parts In-Stock

1+ parts

$1.229

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$1.168

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$1.109

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$1.094

1,842

$1.229

$1.168

$1.109

$1.094

SupplyDigital Components

Austria . 10,428 parts In-Stock

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Problanco Electronics

Mexico . 8,307 parts In-Stock

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Kulean Microsystems

USA . 8,137 parts In-Stock

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TANS Electronics

Latvia . 6,402 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,017 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Alle Elektronik GmbH

Germany . 4,011 parts In-Stock

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Supply Digital

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Perfect Parts

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Glotronic Ltd.

UK . 1,740 parts In-Stock

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Kepictronics

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UHIMA Technologies

Türkiye . 760 parts In-Stock

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760

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Overview

Experience the reliability and quality of Onsemi with the HCPL-2730SD Optocoupler Circuit Outputs. This versatile product offers 2 separate channels for optimal performance in a variety of applications. With a high current transfer ratio and maximum isolation voltage, this optocoupler ensures efficient and safe operation. Trust in Onsemi's expertise to deliver top-notch products that meet your needs. Upgrade your circuits today with the HCPL-2730SD and experience the benefits firsthand.

Feature Benefit Bullets

Configuration: SEPARATE, 2 CHANNELS

Having separate channels allows for isolated transmission of signals, preventing interference and ensuring reliable operation.

No. of Functions: 2

With two functions, this optocoupler can handle multiple input signals simultaneously, making it versatile for various applications.

Maximum Forward Current: 0.02 A

The high maximum forward current ensures that the optocoupler can handle high loads without the risk of overheating or damage.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being a logic IC output optocoupler, this product is suitable for use with digital circuits and microcontrollers, providing efficient signal isolation.

Maximum Operating Temperature: 85 °C

The wide operating temperature range allows this optocoupler to be used in a variety of environments, from industrial settings to consumer electronics.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this optocoupler can withstand cold conditions without compromising performance.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides good conductivity and solderability, ensuring a reliable connection in the circuit.

Maximum Power Dissipation: 0.1 W

The low maximum power dissipation helps in reducing energy consumption and heat generation, making the optocoupler more efficient.

Minimum Current Transfer Ratio: 300%

With a high minimum current transfer ratio, this optocoupler ensures accurate signal transmission and consistent output.

No. of Elements: 2

Having two elements allows for redundancy and increased reliability in the circuit, making this optocoupler a dependable choice.

Maximum Isolation Voltage: 2500 V

The high maximum isolation voltage ensures safe operation and protection against voltage spikes, making this optocoupler ideal for high voltage applications.

Mounting Feature: SURFACE MOUNT

The surface mount design simplifies the installation process and saves space on the PCB, making it suitable for compact electronic devices.

Maximum Forward Voltage: 1.7 V

The low maximum forward voltage drop minimizes power loss and ensures efficient signal transmission, making this optocoupler energy-efficient.

Maximum On State Current: 0.06 A

The high maximum on-state current rating allows the optocoupler to handle heavy loads with ease, making it suitable for demanding applications.

Technical Specifications

Optocoupler Circuit Outputs HCPL-2730SD attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED

Configuration:

SEPARATE, 2 CHANNELS

Minimum Current Transfer Ratio:

300 %

Maximum Forward Current:

.02 A

Maximum Forward Voltage:

1.7 V

Maximum Isolation Voltage:

2500 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

2

No. of Functions:

2

Maximum On State Current:

.06 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Maximum Power Dissipation:

.1 W

Sub-Category:

Optocoupler - Transistor Outputs

Terminal Finish:

Trade Compliance

HCPL-2730SD Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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