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FSB50250BS

Onsemi

FSB50250BS by Onsemi

FSB50250BS by Onsemi is a Motion Control IC with 23 terminals, operating b/w -40 to 125°C. It features a max output current of 5A and supports brushless DC motor control applications. With a package style of MICROELECTRONIC ASSEMBLY, it is suitable for automotive use due to its technology and voltage range of 13.5V to 16.5V.

Median Price

$7.706

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 34 parts In-Stock

1+ parts

$6.971

100+ parts

$4.300

1k+ parts

$3.973

10k+ parts

-

34

$6.971

$4.300

$3.973

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Mouser Electronics

USA . 63 parts In-Stock

1+ parts

$8.440

100+ parts

$4.220

1k+ parts

$3.960

10k+ parts

-

63

$8.440

$4.220

$3.960

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Flip Electronics (Authorized)

USA . 450 parts In-Stock

1+ parts

-

100+ parts

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450

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DigiKey

USA . 440 parts In-Stock

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440

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Farnell

UK . 34 parts In-Stock

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-

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34

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$4.492

100+ parts

-

1k+ parts

-

10k+ parts

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200

$4.492

-

-

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Digiode

USA . 1,187 parts In-Stock

1+ parts

$6.622

100+ parts

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1,187

$6.622

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Chip Stock

USA . 73,000 parts In-Stock

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73,000

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ComSIT Distribution GmbH

Germany . 19,694 parts In-Stock

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19,694

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Vyrian

USA . 7,200 parts In-Stock

1+ parts

-

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7,200

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Flip Electronics

USA . 1,800 parts In-Stock

1+ parts

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1,800

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 462 parts In-Stock

1+ parts

$3.960

100+ parts

-

1k+ parts

-

10k+ parts

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462

$3.960

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-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$4.402

100+ parts

-

1k+ parts

$4.226

10k+ parts

-

2,000

$4.402

-

$4.226

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Argo Parts USA

USA . 685 parts In-Stock

1+ parts

$4.492

100+ parts

-

1k+ parts

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10k+ parts

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685

$4.492

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Ampacity Inc.

Singapore . 124 parts In-Stock

1+ parts

$5.930

100+ parts

-

1k+ parts

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10k+ parts

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124

$5.930

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Corphita

USA . 243 parts In-Stock

1+ parts

$6.274

100+ parts

-

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10k+ parts

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243

$6.274

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Continental Prestige Electronics

USA . 34 parts In-Stock

1+ parts

$6.630

100+ parts

$4.340

1k+ parts

-

10k+ parts

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34

$6.630

$4.340

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Kulean Microsystems

USA . 7,917 parts In-Stock

1+ parts

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7,917

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QUARKTWIN TECHNOLOGY LTD

USA . 5,507 parts In-Stock

1+ parts

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5,507

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Problanco Electronics

Mexico . 4,550 parts In-Stock

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4,550

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Microchip USA

USA . 4,230 parts In-Stock

1+ parts

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4,230

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TANS Electronics

Latvia . 3,638 parts In-Stock

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3,638

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Perfect Parts

USA . 2,408 parts In-Stock

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2,408

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SupplyDigital Components

Austria . 1,756 parts In-Stock

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1,756

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UHIMA Technologies

Türkiye . 450 parts In-Stock

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450

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Authorized Procurement Solutions

USA . 430 parts In-Stock

1+ parts

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430

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GreenTree Electronics

Israel . 430 parts In-Stock

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430

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RC Electronics

USA . 400 parts In-Stock

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400

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Overview

Discover the perfect solution for your motion control needs with the FSB50250BS by Onsemi. As a leading manufacturer in the industry, Onsemi brings you a top-of-the-line product that offers unparalleled quality and reliability. Ideal for a wide range of applications, this Motion Control IC is designed to provide seamless operation and precise control. With advanced technology and a compact design, the FSB50250BS delivers exceptional value and performance. Experience the benefits of superior motion control with Onsemi's innovative product.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards.

Package Shape: RECTANGULAR

Provides a standard shape for compatibility with various applications.

Nominal Supply Voltage (Vsup): 15 V

Ensures stable power supply for optimal performance.

No. of Terminals: 23

Offers flexibility for connecting to external components.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Provides a compact and efficient design for space-saving applications.

Maximum Operating Temperature: 125 °C

Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for a wide range of operating conditions.

Terminal Position: DUAL

Allows for versatile installation options.

Maximum Seated Height: 3.6 mm

Low profile design for compact applications.

Width (mm): 12 mm

Compact size for space-constrained installations.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

Ideal for controlling brushless DC motors with precision.

Minimum Supply Voltage (Vsup): 13.5 V

Allows for operation in lower voltage conditions.

Length: 29 mm

Provides a balanced size for various applications.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature fluctuations are common.

Maximum Supply Current (Isup): 0.9 mA

Efficient power consumption for energy-saving operation.

Maximum Output Current: 5 A

Capable of driving high-current applications.

Technology: HYBRID

Combines the benefits of different technologies for optimal performance.

Terminal Form: GULL WING

Secure terminal connection for reliable operation.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture for long-term reliability.

Maximum Supply Voltage (Vsup): 16.5 V

Supports higher voltage requirements for various applications.

Technical Specifications

Motion Control ICs FSB50250BS attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-XDMA-G23

Length:

29 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

23

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

3.6 mm

Maximum Supply Current (Isup):

.9 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Technology:

HYBRID

Temperature Grade:

Terminal Form:

GULL WING

Terminal Position:

DUAL

Width (mm):

12 mm

Trade Compliance

FSB50250BS Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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