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FQP7P06

Onsemi

FQP7P06 by Onsemi

FQP7P06 by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage and 28A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and operates in ENHANCEMENT MODE. With a max power dissipation of 45W, this transistor has a 0.41 ohm Drain-Source On Resistance and can handle up to 175°C operating temperature.

Median Price

$0.776

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 14,808 parts In-Stock

1+ parts

$0.790

100+ parts

$0.673

1k+ parts

$0.538

10k+ parts

$0.538

14,808

$0.790

$0.673

$0.538

$0.538

Chip1Stop

Japan . 435 parts In-Stock

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$0.921

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435

$0.921

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Rochester

USA . 41,120 parts In-Stock

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$0.735

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$0.610

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$0.544

41,120

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$0.735

$0.610

$0.544

Verical

USA . 40,907 parts In-Stock

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$0.763

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$0.680

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$0.680

DigiKey

USA . 213 parts In-Stock

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$1.410

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RS (Exports)

UK . 125 parts In-Stock

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$0.312

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$0.298

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125

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$0.298

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Distributors (In-Stock)

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Digiode

USA . 2,467 parts In-Stock

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$0.599

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$0.599

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Vyrian

USA . 1,515 parts In-Stock

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$0.631

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$0.631

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TME

Poland . 976 parts In-Stock

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$0.773

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$0.466

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$0.433

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976

$0.773

$0.466

$0.433

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Bristol Electronics

USA . 255 parts In-Stock

1+ parts

$1.688

100+ parts

$1.047

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$0.844

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255

$1.688

$1.047

$0.844

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Chip Stock

USA . 49,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 970 parts In-Stock

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Dan-Mar Components

USA . 725 parts In-Stock

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ComSIT Distribution GmbH

Germany . 684 parts In-Stock

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DigiKey Marketplace

USA . 555 parts In-Stock

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Flip Electronics

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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Lantek

USA . 50 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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15

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LittleDiode

UK . 4 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 13,696 parts In-Stock

1+ parts

$0.540

100+ parts

$0.526

1k+ parts

$0.524

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13,696

$0.540

$0.526

$0.524

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Ampacity Inc.

Singapore . 13,436 parts In-Stock

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$0.540

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Corphita

USA . 2,403 parts In-Stock

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$0.568

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Corohmni

South Africa . 118 parts In-Stock

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$0.631

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Microchip USA

USA . 7,820 parts In-Stock

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$9.295

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$9.295

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Perfect Parts

USA . 33,600 parts In-Stock

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TANS Electronics

Latvia . 5,509 parts In-Stock

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SupplyDigital Components

Austria . 4,969 parts In-Stock

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Argo Parts USA

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Problanco Electronics

Mexico . 3,045 parts In-Stock

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Kulean Microsystems

USA . 2,959 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,465 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 841 parts In-Stock

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Supply Digital

USA . 187 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 100 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the FQP7P06 power field effect transistor by Onsemi. With a reputation for high-quality manufacturing, Onsemi delivers reliable and efficient components for a variety of applications. The FQP7P06 offers customers the value of enhanced switching capabilities, built-in diode configuration, and a durable plastic/epoxy package body material. Upgrade your systems with this P-channel transistor and experience the benefits of increased power dissipation, low drain-source resistance, and reliable operation in enhancement mode. Elevate your technology with the FQP7P06 from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good insulation and protection for the internal components of the FET, ensuring reliability and longevity.

Polarity or Channel Type: P-CHANNEL

P-channel FETs generally have lower ON-state resistance compared to N-channel FETs, resulting in lower power dissipation and higher efficiency.

Minimum DS Breakdown Voltage: 60 V

The 60V breakdown voltage allows for higher voltage switching applications without the risk of damaging the FET.

Maximum Power Dissipation (Abs): 45 W

With a maximum power dissipation of 45W, this FET can handle high power applications efficiently without overheating.

Maximum Operating Temperature: 175 °C

The FET can operate at a maximum temperature of 175°C, making it suitable for high-temperature environments and applications.

Maximum Drain-Source On Resistance: 0.41 ohm

The low ON resistance of 0.41 ohm results in minimal power loss during operation and efficient switching performance.

Technical Specifications

Power Field Effect Transistors (FET) FQP7P06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

90 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.41 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP7P06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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