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FQP70N10

Onsemi

FQP70N10 by Onsemi

FQP70N10 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. It features 228A Max Pulsed Drain Current, 1300mJ Avalanche Energy Rating, and 0.023 ohm Max RDS(on). The transistor operates in ENHANCEMENT MODE and has a max power dissipation of 160W at 175 °C.

Median Price

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Lifecycle Status

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Chip Stock

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Digiode

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Sunrise Surplus Inc.

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Lantek

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Bristol Electronics

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Atlantic Semiconductor

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Native Components

USA . 609 parts In-Stock

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Northwest PG Solutions

USA . 428 parts In-Stock

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Metaverse IC Inc.

Canada . 80,000 parts In-Stock

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RC Electronics

USA . 46,883 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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UHIMA Technologies

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Overview

Elevate your power management game with the FQP70N10 by Onsemi. Designed to deliver superior performance and reliability, this N-channel Power FET is a game-changer in the realm of switching applications. With its built-in diode, high breakdown voltage, and impressive power dissipation capabilities, the FQP70N10 is a powerhouse when it comes to enhancing efficiency and maximizing power handling. Whether you're looking to optimize industrial processes or elevate automotive design, this transistor's cutting-edge technology and quality construction make it a must-have for any project requiring top-notch power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection for the FET, making it suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency, making them a preferred choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds protection against reverse voltage spikes, enhancing the reliability of the FET in high-voltage applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient control of power flow in electronic circuits.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage allows for reliable operation in high-voltage applications without risk of damage.

Package Shape: RECTANGULAR

The rectangular shape provides ease of mounting and secure attachment in electronic systems.

Terminal Form: THROUGH-HOLE

The through-hole terminals offer secure connections and ease of soldering during installation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and low ON-resistance, making them suitable for efficient switching applications.

Maximum Pulsed Drain Current (IDM): 228 A

The high maximum pulsed drain current rating ensures the FET can handle short-duration high current loads without damage.

Avalanche Energy Rating (EAS): 1300 mJ

The high avalanche energy rating indicates the FET's capability to withstand voltage spikes and transient surges without breaking down.

Maximum Power Dissipation (Abs): 160 W

With a high maximum power dissipation rating, the FET can handle high power loads without overheating or damage.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting and efficient heat dissipation, ensuring reliable operation in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency, low power consumption, and fast switching speeds, making it ideal for various electronic applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, the FET can withstand high-temperature environments without loss of performance.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability, efficiency, and compatibility with various electronic applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers corrosion resistance and ensures reliable electrical connections for long-term performance.

Maximum Drain-Source On Resistance: 0.023 ohm

The low ON-resistance ensures minimal power loss and efficient operation of the FET in various switching applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and ensures proper orientation of the FET in electronic circuits.

Technical Specifications

Power Field Effect Transistors (FET) FQP70N10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1300 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

57 A

Maximum Drain Current (ID):

57 A

Maximum Drain-Source On Resistance:

.023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

228 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP70N10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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