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FODM3053V

Onsemi

FODM3053V by Onsemi

TRIAC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Configuration: SINGLE; Maximum On State Current: .07 A; Maximum Operating Temperature: 100 Cel; Maximum Reverse Leakage Current: .0001 A;

Median Price

$0.480

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,090 parts In-Stock

1+ parts

$0.480

100+ parts

$0.470

1k+ parts

$0.460

10k+ parts

-

4,090

$0.480

$0.470

$0.460

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,600 parts In-Stock

1+ parts

$0.456

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-

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2,600

$0.456

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Vyrian

USA . 1,421 parts In-Stock

1+ parts

$0.480

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1,421

$0.480

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 422 parts In-Stock

1+ parts

$0.046

100+ parts

-

1k+ parts

-

10k+ parts

$0.044

422

$0.046

-

-

$0.044

Corphita

USA . 518 parts In-Stock

1+ parts

$0.432

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-

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518

$0.432

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Corohmni

South Africa . 322 parts In-Stock

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$0.480

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322

$0.480

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QUARKTWIN TECHNOLOGY LTD

USA . 23,344 parts In-Stock

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23,344

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TANS Electronics

Latvia . 7,482 parts In-Stock

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7,482

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SupplyDigital Components

Austria . 4,720 parts In-Stock

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4,720

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Kulean Microsystems

USA . 2,504 parts In-Stock

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2,504

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Supply Digital

USA . 1,442 parts In-Stock

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1,442

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Northwest PG Solutions

USA . 1,386 parts In-Stock

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1,386

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Problanco Electronics

Mexico . 805 parts In-Stock

1+ parts

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805

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UHIMA Technologies

Türkiye . 524 parts In-Stock

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524

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Kepictronics

USA . 60 parts In-Stock

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60

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Technical Specifications

Optocoupler Trigger Device Outputs FODM3053V attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

IEC-60747-5-5, UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.005 A

Maximum Isolation Voltage:

3750 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Repetitive Off-state Voltage (Peak):

600 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

FODM3053V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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