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FOD42160

Onsemi

FOD42160 by Onsemi

The Onsemi FOD42160 is a single TRIAC output optocoupler with a max on-state voltage of 3V and peak surge current of 3A. It operates b/w -55 °C to 100°C, with an isolation voltage of 5000V. Ideal for applications requiring optocoupler trigger device outputs in through-hole mounting configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,090 parts In-Stock

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Digiode

USA . 50 parts In-Stock

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Native Components

USA . 403 parts In-Stock

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$0.799

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403

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Northwest PG Solutions

USA . 2,232 parts In-Stock

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$0.878

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Problanco Electronics

Mexico . 7,715 parts In-Stock

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Kulean Microsystems

USA . 5,576 parts In-Stock

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TANS Electronics

Latvia . 4,987 parts In-Stock

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SupplyDigital Components

Austria . 2,031 parts In-Stock

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Corphita

USA . 1,482 parts In-Stock

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Corohmni

South Africa . 495 parts In-Stock

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UHIMA Technologies

Türkiye . 404 parts In-Stock

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Overview

Upgrade your electronic devices with the FOD42160 by Onsemi and experience top-notch quality and reliability. As a leading manufacturer in the industry, Onsemi guarantees superior performance and durability. The FOD42160 is a versatile optocoupler trigger device output suitable for a wide range of applications. Enjoy the benefits of a high peak surge current, low forward current, and impressive isolation voltage. Trust Onsemi to deliver cutting-edge technology that enhances the functionality of your products while providing exceptional value to our customers.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low on state voltage helps in efficient operation and reduces power consumption.

Configuration: SINGLE

Single configuration makes it simple to use and reduces complexity in setup.

Peak Surge Current: 3 A

High surge current capacity ensures reliable performance even during power surges.

Maximum Forward Current: 0.03 A

Low forward current enhances device efficiency and minimizes heat generation.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler design provides high performance and reliability in switching applications.

Maximum Operating Temperature: 100 °C

Wide operating temperature range enables use in varied environments without performance degradation.

Minimum Operating Temperature: -55 °C

Ability to operate in low temperatures makes it suitable for diverse applications.

Maximum Input Trigger Current: 0.0013 A

Low input trigger current allows for efficient control and responsiveness.

Repetitive Off-state Voltage (Peak): 600 V

High off-state voltage rating ensures safety and reliability in isolation applications.

Packing Method: TUBE

Tube packaging provides protection during transportation and storage, ensuring product integrity.

Maximum Reverse Leakage Current: 0.00001 A

Low reverse leakage current improves overall device efficiency and performance.

Minimum Peak Off-state Voltage: 600 V

High off-state voltage rating ensures reliability in maintaining isolation between circuits.

Maximum Isolation Voltage: 5000 V

High isolation voltage rating ensures safe operation in high voltage environments.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature offers easy and secure installation in various systems.

Maximum On State Current: 0.3 A

High on state current enables efficient switching and control of higher loads.

Technical Specifications

Optocoupler Trigger Device Outputs FOD42160 attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Configuration:

SINGLE

Maximum Forward Current:

.03 A

Maximum Input Trigger Current:

.0013 A

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.3 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Optoelectronic Type:

Packing Method:

TUBE

Minimum Peak Off-state Voltage:

600 V

Peak Surge Current:

3 A

Repetitive Off-state Voltage (Peak):

600 V

Maximum Reverse Leakage Current:

.00001 A

Trade Compliance

FOD42160 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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