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FODM3023V

Onsemi

FODM3023V by Onsemi

FODM3023V by Onsemi is a single TRIAC output optocoupler with a max on-state voltage of 3V and forward current of 0.06A. It operates b/w -40 °C to 100°C, has an isolation voltage of 3750V, and is ideal for applications requiring optocoupler trigger device outputs in surface mount configurations.

Median Price

$0.412

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 450 parts In-Stock

1+ parts

$0.412

100+ parts

$0.375

1k+ parts

$0.338

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450

$0.412

$0.375

$0.338

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Distributors (In-Stock)

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Digiode

USA . 2,425 parts In-Stock

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$0.391

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$0.391

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Vyrian

USA . 8,438 parts In-Stock

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8,438

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Distributors (Availability)

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Corohmni

South Africa . 152 parts In-Stock

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$0.300

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152

$0.300

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Corphita

USA . 916 parts In-Stock

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$0.371

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916

$0.371

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$0.412

100+ parts

$0.375

1k+ parts

$0.338

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450

$0.412

$0.375

$0.338

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Native Components

USA . 944 parts In-Stock

1+ parts

$1.570

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944

$1.570

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Northwest PG Solutions

USA . 926 parts In-Stock

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$1.727

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926

$1.727

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QUARKTWIN TECHNOLOGY LTD

USA . 8,052 parts In-Stock

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8,052

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Problanco Electronics

Mexico . 7,930 parts In-Stock

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TANS Electronics

Latvia . 7,193 parts In-Stock

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Kulean Microsystems

USA . 3,360 parts In-Stock

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SupplyDigital Components

Austria . 2,069 parts In-Stock

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2,069

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Supply Digital

USA . 1,956 parts In-Stock

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UHIMA Technologies

Türkiye . 292 parts In-Stock

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Overview

Unleash the power of reliable optocoupler trigger devices with Onsemi's FODM3023V. Designed for precision and performance, this TRIAC output optocoupler offers unmatched quality and durability for a wide range of applications. From industrial controls to power supplies, this single configuration device delivers maximum on-state voltage of 3V and a forward current of 0.06A. With an impressive isolation voltage of 3750V and a compact surface mount design, the FODM3023V ensures safety and efficiency in every project. Elevate your electronics with Onsemi's cutting-edge technology and experience the difference firsthand.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low on state voltage allows for efficient switching and reduces power consumption.

Configuration: SINGLE

Simplified configuration for easy integration and use.

Maximum Forward Current: 0.06 A

Able to handle high forward currents for reliable operation.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler offers high electrical isolation and noise immunity.

Maximum Operating Temperature: 100 °C

Wide operating temperature range for versatility and reliability in various environments.

Minimum Operating Temperature: -40 °C

Able to operate in low temperature conditions without issues.

Maximum Input Trigger Current: 0.005 A

Low input trigger current for efficient control and low power consumption.

Repetitive Off-state Voltage (Peak): 400 V

High off-state voltage allows for handling high voltage applications.

Packing Method: TUBE

Tube packing for easy handling and storage.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current for improved performance and efficiency.

Maximum Isolation Voltage: 3750 V

High isolation voltage for safe operation in high voltage applications.

Mounting Feature: SURFACE MOUNT

Surface mount design for easy and secure mounting on PCBs.

Maximum On State Current: 0.07 A

Capable of handling high currents in on state for reliable switching.

Technical Specifications

Optocoupler Trigger Device Outputs FODM3023V attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

IEC-60747-5-5, UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.005 A

Maximum Isolation Voltage:

3750 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Repetitive Off-state Voltage (Peak):

400 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

FODM3023V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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