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FODM3023

Onsemi

FODM3023 by Onsemi

The Onsemi FODM3023 is a single TRIAC output optocoupler with max on-state voltage of 3V and forward current of 0.06A. It operates b/w -40 to 100 °C, has isolation voltage of 3750V, and peak off-state voltage of 400V. Ideal for triggering devices in applications requiring high isolation levels and surface mounting feature.

Median Price

$0.390

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,227 parts In-Stock

1+ parts

$0.390

100+ parts

$0.380

1k+ parts

$0.370

10k+ parts

-

3,227

$0.390

$0.380

$0.370

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,863 parts In-Stock

1+ parts

$0.370

100+ parts

-

1k+ parts

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10k+ parts

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2,863

$0.370

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-

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Vyrian

USA . 1,726 parts In-Stock

1+ parts

$0.390

100+ parts

-

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1,726

$0.390

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Prism Electronics

USA . 200 parts In-Stock

1+ parts

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200

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Cyclops Electronics Ltd

UK . 170 parts In-Stock

1+ parts

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170

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,144 parts In-Stock

1+ parts

$0.332

100+ parts

-

1k+ parts

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3,144

$0.332

-

-

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Corphita

USA . 2,021 parts In-Stock

1+ parts

$0.351

100+ parts

-

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2,021

$0.351

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-

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Corohmni

South Africa . 416 parts In-Stock

1+ parts

$0.390

100+ parts

-

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416

$0.390

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Northwest PG Solutions

USA . 638 parts In-Stock

1+ parts

$2.585

100+ parts

-

1k+ parts

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638

$2.585

-

-

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Component Stockers USA

USA . 692 parts In-Stock

1+ parts

$99.990

100+ parts

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692

$99.990

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Metaverse IC Inc.

Canada . 36,800 parts In-Stock

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36,800

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QUARKTWIN TECHNOLOGY LTD

USA . 28,646 parts In-Stock

1+ parts

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28,646

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Kulean Microsystems

USA . 7,340 parts In-Stock

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7,340

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Problanco Electronics

Mexico . 6,903 parts In-Stock

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6,903

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SupplyDigital Components

Austria . 3,481 parts In-Stock

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3,481

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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TANS Electronics

Latvia . 1,189 parts In-Stock

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1,189

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Supply Digital

USA . 781 parts In-Stock

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781

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Native Components

USA . 709 parts In-Stock

1+ parts

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1k+ parts

$2.279

10k+ parts

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709

-

-

$2.279

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Kepictronics

USA . 87 parts In-Stock

1+ parts

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87

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Perfect Parts

USA . 45 parts In-Stock

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45

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UHIMA Technologies

Türkiye . 9 parts In-Stock

1+ parts

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9

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Overview

Experience the superior quality and reliability of the FODM3023 by Onsemi, a leading manufacturer in the industry. This optocoupler trigger device output offers unparalleled performance and versatility, making it ideal for a wide range of applications. With its high isolation voltage, low input trigger current, and efficient operation, the FODM3023 provides customers with exceptional value and benefits. Trust Onsemi to deliver innovative solutions that meet your needs and exceed your expectations. Upgrade your systems with the FODM3023 and experience the difference today.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low on-state voltage results in efficient power consumption and reduces heat generation, making this optocoupler a reliable choice for various applications.

Configuration: SINGLE

Single configuration simplifies the circuit design and makes it easier to implement in projects, providing ease of use and reliability.

Maximum Forward Current: 0.06 A

A high maximum forward current allows for handling higher loads, making this optocoupler suitable for various demanding applications.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler design provides versatility in controlling AC loads, making this product a versatile choice for AC switching applications.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliability in harsh environments, making this optocoupler suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in cold environments without performance degradation, enhancing the optocoupler's versatility.

Maximum Input Trigger Current: 0.005 A

Low trigger current requirement ensures efficiency in triggering the optocoupler, making it suitable for low-power applications.

Repetitive Off-state Voltage (Peak): 400 V

High off-state voltage capability ensures reliable isolation between input and output, enhancing the safety and performance of the optocoupler.

Packing Method: TUBE

Tube packing method ensures protection during transportation and storage, maintaining the integrity of the optocoupler until it is ready for use.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current minimizes power loss and ensures the efficiency of the optocoupler, making it a reliable choice for various applications.

Maximum Isolation Voltage: 3750 V

High isolation voltage rating ensures safety and reliable operation in high-voltage applications, making this optocoupler suitable for demanding environments.

Mounting Feature: SURFACE MOUNT

Surface mount feature allows for easy and secure mounting on PCBs, enhancing the optocoupler's usability in compact electronic devices.

Maximum On State Current: 0.07 A

High maximum on-state current capability allows for handling heavy loads with ease, making this optocoupler a reliable choice for various high-current applications.

Technical Specifications

Optocoupler Trigger Device Outputs FODM3023 attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.005 A

Maximum Isolation Voltage:

3750 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Repetitive Off-state Voltage (Peak):

400 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

FODM3023 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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