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FOD8482R2

Onsemi

FOD8482R2 by Onsemi

FOD8482R2 by Onsemi is a single optocoupler with a max forward current of 0.02A and isolation voltage of 5000V. Ideal for logic IC output applications, it operates b/w -40 to 100°C temperature range. Featuring surface mounting, it has a matte tin finish and can handle up to 0.025A on-state current.

Median Price

$1.160

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 500 parts In-Stock

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$1.160

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500

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Flip Electronics (Authorized)

USA . 500 parts In-Stock

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500

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Digiode

USA . 737 parts In-Stock

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$3.258

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737

$3.258

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Vyrian

USA . 7,997 parts In-Stock

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Flip Electronics

USA . 500 parts In-Stock

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500

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Distributors (Availability)

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Corphita

USA . 471 parts In-Stock

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$3.087

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471

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Corohmni

South Africa . 283 parts In-Stock

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$3.430

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SupplyDigital Components

Austria . 7,266 parts In-Stock

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Problanco Electronics

Mexico . 5,943 parts In-Stock

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TANS Electronics

Latvia . 3,297 parts In-Stock

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Kulean Microsystems

USA . 2,163 parts In-Stock

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Northwest PG Solutions

USA . 1,158 parts In-Stock

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UHIMA Technologies

Türkiye . 971 parts In-Stock

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Native Components

USA . 499 parts In-Stock

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Overview

Experience superior performance and reliability with the FOD8482R2 optocoupler circuit output by Onsemi. Designed with precision and expertise, this product offers exceptional quality and efficiency, making it the ideal choice for a wide range of applications. From logic IC outputs to surface mounting features, this optocoupler provides value and benefits that will elevate your projects to new heights. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to use and integrate into circuit designs.

Maximum Forward Current: 0.02 A

Can handle a maximum forward current of 0.02 A, making it suitable for low power applications.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Optocoupler designed specifically for logic IC output applications, ensuring compatibility and efficiency.

Minimum Supply Voltage: 4.5 V

Can operate at a relatively low minimum supply voltage of 4.5 V, suitable for many power sources.

Maximum Operating Temperature: 100 °C

Capable of operating in temperatures up to 100°C, suitable for a wide range of environments.

Minimum Operating Temperature: -40 °C

Capable of operating in very low temperatures down to -40°C, ensuring reliability in harsh conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finish provides enhanced durability and conductivity for reliable connections.

Packing Method: TR

TR packing method ensures easy handling and storage for convenient use.

Maximum Isolation Voltage: 5000 V

Can handle maximum isolation voltage of 5000V, ensuring safe operation in high voltage applications.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for easy and secure installation on circuit boards.

Maximum On State Current: 0.025 A

Capable of handling a maximum on-state current of 0.025 A, suitable for various output requirements.

Technical Specifications

Optocoupler Circuit Outputs FOD8482R2 attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.02 A

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.025 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR

Minimum Supply Voltage:

4.5 V

Terminal Finish:

Trade Compliance

FOD8482R2 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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