Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FOD8320R2V by Onsemi is a Logic IC Output Optocoupler with 0.025A max forward current, 5000V isolation voltage, and 1.8V max forward voltage. Ideal for applications requiring high-speed response time and surface mounting feature in temperature range of -40 to 100°C.
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The low forward current allows for efficient power usage and helps prevent overheating.
This type of optocoupler is specifically designed for logic IC output applications, ensuring compatibility and reliable performance.
With a high maximum operating temperature, this product is suitable for demanding industrial or automotive applications.
The wide operating temperature range allows for reliable operation in both extreme cold and hot environments.
The matte tin finish provides good solderability and resistance to corrosion, ensuring a reliable electrical connection.
The low power dissipation helps in reducing energy consumption and increasing overall efficiency.
The extremely fast response time enables quick signal transmission and helps in achieving precise control.
The high isolation voltage ensures safe electrical separation between input and output circuits, making it suitable for high voltage applications.
The surface mount design simplifies the assembly process and allows for compact and space-saving installations.
The low forward voltage drop minimizes power loss and ensures efficient signal transmission.
Optocoupler Circuit Outputs FOD8320R2V attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi
Maximum Forward Current:
Maximum Forward Voltage:
Maximum Isolation Voltage:
JESD-609 Code:
Mounting Feature:
No. of Elements:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optoelectronic Type:
Maximum Power Dissipation:
Maximum Response Time:
Sub-Category:
Terminal Finish:
FOD8320R2V Optoelectronics trade compliance attributes, and parameters.
HTS
8541.40.80.00
SB
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N7002
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
LM78L05ACMX/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
06035C103KAT2A
KYOCERA AVX
06035C103KAT2A by KYOCERA AVX is a SMT ceramic capacitor with 0.01uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and 10% tolerance. Ideal for applications requiring compact surface mount capacitors with stable performance in a wide temperature range.
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
1N4148
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148WS
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WT
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Fairchild Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
Meritek Electronics
DP83848IVVX/NOPB
Texas Instruments
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
STM32H750VBT6
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
HCPL-2630-300E
Agilent Technologies
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Tin (Sn); Maximum Operating Temperature: 85 Cel; No. of Functions: 2; Additional Features: UL RECOGNIZED, OPEN COLLECTOR;
HCPL2630
Onsemi
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3; Configuration: SEPARATE, 2 CHANNELS; Maximum Isolation Voltage: 2500 V;
H11L1
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Isolation Voltage: 2250 V; Maximum Forward Current: .06 A; Additional Features: OPEN COLLECTOR, UL RECOGNIZED, VDE APPROVED; Configuration: SINGLE;
6N137
General Instrument Optoelectronics
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: TIN; Minimum Supply Voltage: 4.5 V; Maximum Operating Temperature: 85 Cel; Packing Method: TUBE;
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Forward Current: .02 A; Maximum Operating Temperature: 85 Cel; Configuration: SINGLE; Maximum Isolation Voltage: 3750 V;
PC457L0NIP0F
Sharp Corporation
Sharp Corporation's PC457L0NIP0F is a single optocoupler with max forward current of 0.016A and isolation voltage of 3750V. Ideal for logic IC output applications, it operates b/w 0-70°C with a data rate of 1MBps and max on-state current of 0.008A.
6N139-X007T
Vishay Intertechnology
Vishay Intertechnology's 6N139-X007T optocoupler features a max forward current of 0.025A, min operating temp of -55°C, and max isolation voltage of 5300V. Ideal for applications requiring high current transfer ratio, fast response time, and surface mounting feature.
FODM452R2
The Onsemi FODM452R2 is a single optocoupler with a max forward current of 0.025A and isolation voltage of 3750V. Ideal for logic IC output applications, it operates b/w -40 to 85°C, with a min CTR of 15% and data rate of 1MBps.
OPT101P-J
Burr-Brown Corporation
LINEAR IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); No. of Functions: 1; Application: AMPLIFIER; Nominal Supply Voltage: 36 V;
5962-8978501ZA
Defense Logistics Agency
Defense Logistics Agency's 5962-8978501ZA is a 2-channel optocoupler with built-in resistor. It has a max forward current of 0.01A and operates b/w -55 to 125 °C. Ideal for logic IC output applications, offering high isolation voltage of 1500V and data rate of 0.1 MBps.
HCPL-2631.SD
Qt Optoelectronics
HCPL-2631.SD by Qt Optoelectronics is a 2-channel optocoupler with max. forward current of 0.03A and max. isolation voltage of 2500V. Ideal for logic IC output applications, it operates b/w -40°C to 85°C with a nominal data rate of 10MBps.
FOD8012AR2
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Nominal Data Rate: 1.875 MBps; Packing Method: TR; Configuration: SEPARATE, 2 CHANNELS;
HCPL3700SD
HCPL3700SD by Onsemi is a COMPLEX optocoupler with 0.05A forward current, 2V min supply voltage, and 85°C max operating temp. Ideal for logic IC output applications, it offers 2500V isolation voltage, 40000ns response time, and surface mounting feature.
6N136-V
Lite-on Technology
Lite-on Technology's 6N136-V is a single optocoupler with max forward current of 0.025A and isolation voltage of 2500V. Ideal for logic IC output applications, it operates b/w -55°C to 100°C with max on-state current of 0.008A.
6N135
Isocom Components
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: TIN; Maximum Isolation Voltage: 2500 V; Minimum Operating Temperature: 0 Cel; Additional Features: OPEN COLLECTOR, UL RECOGNIZED, TTL COMPATIBLE;
HCPL-2730
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 70 Cel; No. of Elements: 2; Minimum Supply Voltage: 4.5 V; Maximum On State Current: .06 A;
TLP2745
Toshiba
Toshiba's TLP2745 is a single optocoupler with max. forward current of 0.015A, ideal for logic IC outputs. With a response time of 3ns and isolation voltage of 5000V, it operates b/w -40 to 110°C. Suitable for surface mount applications requiring fast signal transmission and high voltage isolation.
6N136SDM
6N136SDM by Onsemi is a single optocoupler with 0.025A forward current, 15% min. current transfer ratio, and 5000V isolation voltage. Ideal for logic IC output applications with 1MBps data rate, operating b/w 0-70°C in surface mount configurations.
HCPL-2730SD
HCPL-2730SD by Onsemi is a 2-channel logic IC output optocoupler with separate configuration. It offers a min current transfer ratio of 300%, max isolation voltage of 2500V, and operates b/w -40 to 85°C. Ideal for applications requiring surface mounting feature and high forward current capability up to 0.06A.
HCPL0501R2
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: Matte Tin (Sn); Configuration: SINGLE; Packing Method: TR; No. of Functions: 1; No. of Elements: 1;
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FOD8012AR2 by Onsemi is a 2-channel logic IC output optocoupler with separate configuration. It operates b/w -40 to 110 °C and offers an isolation voltage of 3750 V. Ideal for applications requiring fast response times, such as high-speed data communication systems.
FOD8012A
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; No. of Functions: 1; Packing Method: TUBE; Configuration: SEPARATE, 2 CHANNELS;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Maximum Isolation Voltage: 3750 V; Minimum Supply Voltage: 3 V;
FOD8320R2V
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); No. of Elements: 1; Maximum Forward Current: .025 A; Maximum Response Time: .0000005 s;
FOD8342TR2
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Minimum Supply Voltage: 10 V; Packing Method: TR; Maximum Operating Temperature: 100 Cel;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; No. of Functions: 1; No. of Elements: 1; Maximum Forward Current: .025 A;
FOD8160R2V
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Maximum Forward Current: .025 A; Nominal Response Time: 90 ns; Maximum Power Dissipation: .085 W;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Nominal Response Time: 90 ns; JESD-609 Code: e3; Maximum Isolation Voltage: 5000 V;
FOD8342R2
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Packing Method: TR; No. of Elements: 1; Shape: RECTANGULAR;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 100 Cel; Shape: RECTANGULAR; Configuration: SINGLE;
FOD8160R2
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Nominal Response Time: 90 ns; Maximum Isolation Voltage: 5000 V; Minimum Operating Temperature: -40 Cel;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Nominal Supply Voltage: 5.5 V; Minimum Operating Temperature: -40 Cel; No. of Elements: 1;
FOD8342TR2V
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Minimum Supply Voltage: 10 V; Configuration: SINGLE; Maximum Operating Temperature: 100 Cel;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; No. of Functions: 1; Maximum Forward Current: .025 A; Minimum Supply Voltage: 10 V;
FOD8384V
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Maximum Isolation Voltage: 5000 V; Maximum Forward Current: .025 A; Maximum Operating Temperature: 100 Cel; Maximum Power Dissipation: .5 W;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Maximum Power Dissipation: .5 W; JESD-609 Code: e3; Minimum Operating Temperature: -40 Cel;
FOD8342
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Additional Features: UL APPROVED; Shape: RECTANGULAR; JESD-609 Code: e3;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Maximum Forward Current: .025 A; No. of Elements: 1; Shape: RECTANGULAR;
FOD8320
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); No. of Elements: 1; Maximum Isolation Voltage: 5000 V; Maximum Forward Current: .025 A;
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