Loading...

FOD8334R2

Onsemi

FOD8334R2 by Onsemi

FOD8334R2 by Onsemi is a single optocoupler transistor output with a max forward current of 0.025 A. It has a logic IC output and can operate in temperatures ranging from -40 to 100 °C. This surface mount device has a max isolation voltage of 4243 V and is commonly used in various electronic applications.

Median Price

$4.905

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 800 parts In-Stock

1+ parts

$4.905

100+ parts

-

1k+ parts

-

10k+ parts

-

800

$4.905

-

-

-

Vyrian

USA . 6,528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,528

-

-

-

-

Digiode

USA . 108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

108

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 47 parts In-Stock

1+ parts

$0.322

100+ parts

$0.293

1k+ parts

$0.264

10k+ parts

-

47

$0.322

$0.293

$0.264

-

Corohmni

South Africa . 52 parts In-Stock

1+ parts

$0.777

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$0.777

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$4.905

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$4.905

-

-

-

AZTECH Wire

Italy . 209 parts In-Stock

1+ parts

$8.063

100+ parts

-

1k+ parts

-

10k+ parts

-

209

$8.063

-

-

-

Ampacity Inc.

Singapore . 450 parts In-Stock

1+ parts

$10.100

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$10.100

-

-

-

SupplyDigital Components

Austria . 7,476 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,476

-

-

-

-

Problanco Electronics

Mexico . 7,311 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,311

-

-

-

-

TANS Electronics

Latvia . 4,551 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,551

-

-

-

-

Corphita

USA . 2,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,240

-

-

-

-

Kulean Microsystems

USA . 1,059 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,059

-

-

-

-

UHIMA Technologies

Türkiye . 942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

942

-

-

-

-

Overview

Introducing the FOD8334R2 by Onsemi, a high-quality optocoupler transistor output that brings exceptional value to your applications. With Onsemi's renowned reputation for manufacturing excellence, you can trust in the reliability and durability of this product. Designed for single configuration and surface mounting feature, it offers maximum isolation voltage of 4243V and minimum operating temperature of -40C, making it suitable for a wide range of environments. Experience the benefits of its logic IC output optocoupler technology and maximum forward current of 0.025A, ensuring optimal performance and efficiency. Upgrade your projects with the FOD8334R2 and unlock new possibilities today!

Feature Benefit Bullets

Configuration: SINGLE

This product's configuration as a single optocoupler transistor output makes it suitable for applications that require isolation and amplification of logic IC outputs.

Maximum Forward Current: 0.025 A

With a high maximum forward current rating, this optocoupler transistor output can handle demanding loads, ensuring reliable performance and efficient power transfer.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being specifically designed as a logic IC output optocoupler, this product provides reliable and accurate signal transmission between different electrical systems or circuits.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this optocoupler transistor output can withstand high-temperature environments, making it suitable for various industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range of this product (-40°C to 100°C) allows it to operate in extreme environments, ensuring consistent performance and reliability.

Maximum Power Dissipation: 600 W

The high maximum power dissipation capability of 600 W enables this optocoupler transistor output to handle high power levels, making it suitable for power-sensitive applications.

Packing Method: TR

This optocoupler transistor output is packed in a TR package, which provides convenient handling and protection during transportation and storage.

Maximum Isolation Voltage: 4243 V

With a maximum isolation voltage of 4243 V, this product ensures safe and reliable isolation between input and output circuits, making it ideal for applications that require electrical isolation.

Mounting Feature: SURFACE MOUNT

The surface mounting feature of this optocoupler transistor output simplifies the installation process and allows for compact circuit board designs.

Maximum Forward Voltage: 1.8 V

With a low forward voltage of 1.8 V, this product minimizes power loss and energy consumption, making it an efficient choice for applications that require low voltage operation.

Technical Specifications

Optocoupler Transistor Outputs FOD8334R2 attributes and parameters. Explore more Optocoupler Transistor Outputs devices from Onsemi

Specs

Configuration:

SINGLE

Maximum Forward Current:

.025 A

Maximum Forward Voltage:

1.8 V

Maximum Isolation Voltage:

4243 V

Mounting Feature:

No. of Elements:

1

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR

Maximum Power Dissipation:

600 W

Trade Compliance

FOD8334R2 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20