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FND43060T2

Onsemi

FND43060T2 by Onsemi

FND43060T2 by Onsemi is a Motion Control IC with 26 terminals, operating at -40 to 125 °C. It features a max output current of 60A and supports up to 400V supply voltage. Ideal for automotive applications, this AC motor controller uses hybrid technology in a ceramic-metal sealed co-fired package.

Median Price

$18.670

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 69 parts In-Stock

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$18.670

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$11.830

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$18.670

$11.830

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DigiKey

USA . 6 parts In-Stock

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$18.670

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$10.628

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$10.343

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6

$18.670

$10.628

$10.343

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Chip1Stop

Japan . 56 parts In-Stock

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$246.340

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56

$246.340

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Verical

USA . 24 parts In-Stock

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$17.878

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$17.878

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Digiode

USA . 582 parts In-Stock

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$16.321

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$16.321

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Rapid Electronics

USA . 56 parts In-Stock

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$22.770

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56

$22.770

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Chip Stock

USA . 49,000 parts In-Stock

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49,000

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Vyrian

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Distributors (Availability)

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Native Components

USA . 983 parts In-Stock

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$12.841

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983

$12.841

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Northwest PG Solutions

USA . 1,072 parts In-Stock

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$14.125

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$12.712

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1,072

$14.125

$12.712

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Corphita

USA . 853 parts In-Stock

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$15.462

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853

$15.462

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Corohmni

South Africa . 405 parts In-Stock

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$17.180

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Microchip USA

USA . 9,130 parts In-Stock

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$51.152

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Kulean Microsystems

USA . 6,301 parts In-Stock

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TANS Electronics

Latvia . 5,421 parts In-Stock

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Problanco Electronics

Mexico . 4,948 parts In-Stock

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SupplyDigital Components

Austria . 4,253 parts In-Stock

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UHIMA Technologies

Türkiye . 375 parts In-Stock

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375

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Perfect Parts

USA . 190 parts In-Stock

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Overview

Enhance the performance of your motion control applications with the FND43060T2 by Onsemi. Crafted with precision using ceramic and metal-sealed cofired packaging, this AC motor controller offers unparalleled reliability and durability. With a maximum output current of 60A and a wide temperature range, this hybrid technology IC is perfect for automotive use. Elevate your projects with the quality and expertise of Onsemi, and experience seamless motion control like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This combination of materials provides durability and reliability, making the product suitable for harsh environments.

Nominal Supply Voltage (Vsup): 300 V

The high supply voltage allows for efficient and powerful control of motion, making it ideal for applications requiring high performance.

No. of Terminals: 26

The ample number of terminals allows for flexibility in connecting various components and peripherals, enhancing the product's versatility.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand demanding temperature conditions without compromising performance.

Technology: HYBRID

The hybrid technology used in the product integrates the benefits of different technologies, resulting in efficient and optimized performance.

Maximum Output Current: 60 A

The high maximum output current capability ensures the product can handle demanding loads and provide reliable motion control.

Technical Specifications

Motion Control ICs FND43060T2 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-CDFM-T26

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

26

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

60 A

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Maximum Supply Voltage (Vsup):

400 V

Nominal Supply Voltage (Vsup):

300 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

FND43060T2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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