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FL7760BM6X

Onsemi

FL7760BM6X by Onsemi

LED DISPLAY DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

Median Price

$0.606

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

1+ parts

$0.341

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$0.341

-

-

-

Mouser Electronics

USA . 21,367 parts In-Stock

1+ parts

$0.700

100+ parts

$0.433

1k+ parts

$0.372

10k+ parts

$0.345

21,367

$0.700

$0.433

$0.372

$0.345

DigiKey

USA . 7,272 parts In-Stock

1+ parts

$0.770

100+ parts

$0.433

1k+ parts

$0.372

10k+ parts

$0.341

7,272

$0.770

$0.433

$0.372

$0.341

Farnell

UK . 921 parts In-Stock

1+ parts

$0.772

100+ parts

$0.406

1k+ parts

$0.316

10k+ parts

$0.285

921

$0.772

$0.406

$0.316

$0.285

Newark

USA . 921 parts In-Stock

1+ parts

$0.937

100+ parts

$0.493

1k+ parts

-

10k+ parts

-

921

$0.937

$0.493

-

-

Rochester

USA . 5,340 parts In-Stock

1+ parts

-

100+ parts

$0.424

1k+ parts

$0.352

10k+ parts

$0.314

5,340

-

$0.424

$0.352

$0.314

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Verical

USA . 2,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.440

10k+ parts

$0.392

2,950

-

-

$0.440

$0.392

Chip1Stop

Japan . 1,435 parts In-Stock

1+ parts

-

100+ parts

$0.366

1k+ parts

$0.320

10k+ parts

-

1,435

-

$0.366

$0.320

-

Element14

Singapore . 921 parts In-Stock

1+ parts

-

100+ parts

$0.606

1k+ parts

$0.540

10k+ parts

$0.470

921

-

$0.606

$0.540

$0.470

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,763 parts In-Stock

1+ parts

$0.306

100+ parts

-

1k+ parts

-

10k+ parts

-

1,763

$0.306

-

-

-

Digiode

USA . 1,750 parts In-Stock

1+ parts

$0.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,750

$0.330

-

-

-

Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,000

-

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,048 parts In-Stock

1+ parts

$0.295

100+ parts

-

1k+ parts

-

10k+ parts

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7,048

$0.295

-

-

-

Corohmni

South Africa . 497 parts In-Stock

1+ parts

$0.306

100+ parts

-

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-

10k+ parts

-

497

$0.306

-

-

-

Corphita

USA . 1,662 parts In-Stock

1+ parts

$0.312

100+ parts

-

1k+ parts

-

10k+ parts

-

1,662

$0.312

-

-

-

Continental Prestige Electronics

USA . 1,180 parts In-Stock

1+ parts

$0.744

100+ parts

$0.464

1k+ parts

$0.310

10k+ parts

$0.297

1,180

$0.744

$0.464

$0.310

$0.297

Problanco Electronics

Mexico . 8,102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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8,102

-

-

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SupplyDigital Components

Austria . 7,043 parts In-Stock

1+ parts

-

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7,043

-

-

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Kulean Microsystems

USA . 5,350 parts In-Stock

1+ parts

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100+ parts

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5,350

-

-

-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

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3,000

-

-

-

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Infinite Electronics LLP (Excess)

. 2,086 parts In-Stock

1+ parts

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2,086

-

-

-

-

TANS Electronics

Latvia . 923 parts In-Stock

1+ parts

-

100+ parts

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923

-

-

-

-

UHIMA Technologies

Türkiye . 787 parts In-Stock

1+ parts

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787

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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50

-

-

-

-

Technical Specifications

Graphics Display Drivers FL7760BM6X attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

PARALLEL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.85 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Maximum Supply Current:

.495 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Minimum fmax:

1 MHz

Trade Compliance

FL7760BM6X Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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