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FHP3350IMTC14X

Onsemi

FHP3350IMTC14X by Onsemi

FHP3350IMTC14X by Onsemi is a video amplifier IC with 3 functions, operating temperature range of -40 to 85 °C. It has a gain of 55 dB, nominal bandwidth of 190 kHz, and operates at supply voltages from 3V to 12V. This small outline package is ideal for audio and video amplification applications in industrial settings.

Median Price

$0.846

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 70 parts In-Stock

1+ parts

-

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$0.846

1k+ parts

$0.702

10k+ parts

$0.626

70

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$0.846

$0.702

$0.626

Distributors (In-Stock)

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Digiode

USA . 1,171 parts In-Stock

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$0.658

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$0.658

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Vyrian

USA . 3,335 parts In-Stock

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Prism Electronics

USA . 50 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 855 parts In-Stock

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$0.147

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$0.141

855

$0.147

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$0.141

Northwest PG Solutions

USA . 1,810 parts In-Stock

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$0.161

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$0.142

1,810

$0.161

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$0.142

Ampacity Inc.

Singapore . 70 parts In-Stock

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$0.590

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70

$0.590

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Corphita

USA . 3,201 parts In-Stock

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$0.624

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$0.624

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Corohmni

South Africa . 88 parts In-Stock

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$0.693

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Microchip USA

USA . 188 parts In-Stock

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$4.355

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QUARKTWIN TECHNOLOGY LTD

USA . 22,116 parts In-Stock

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TANS Electronics

Latvia . 7,874 parts In-Stock

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Kulean Microsystems

USA . 6,264 parts In-Stock

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SupplyDigital Components

Austria . 1,883 parts In-Stock

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Supply Digital

USA . 1,207 parts In-Stock

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UHIMA Technologies

Türkiye . 922 parts In-Stock

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Problanco Electronics

Mexico . 630 parts In-Stock

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Perfect Parts

USA . 56 parts In-Stock

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Overview

Elevate your audio and video experience with the FHP3350IMTC14X by Onsemi. Crafted with precision and expertise, this video amplifier offers unparalleled quality and performance for a wide range of applications. With a compact design and advanced technology, this product delivers exceptional value and benefits to customers looking to enhance their entertainment systems. Trust in Onsemi's reputation for excellence and elevate your audiovisual experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space.

No. of Functions: 3

Having multiple functions in a single component simplifies circuit design and reduces overall component count.

General IC Type: VIDEO AMPLIFIER

Video amplifier type ensures high-quality video signal amplification, suitable for use in audio and video applications.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting to other components and peripherals.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions without compromising performance.

Technology: BIPOLAR

Bipolar technology offers high accuracy and low noise amplification, critical for audio and video applications.

Nominal Bandwidth: 190 kHz

Wide bandwidth capability supports high-speed data transmission and enhances signal clarity.

Gain: 55 dB

High gain level ensures optimal amplification of video signals, improving overall signal quality.

Technical Specifications

Audio & Video Amplifiers FHP3350IMTC14X attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

Nominal Bandwidth:

190 kHz

General IC Type:

Gain:

55 dB

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

No. of Channels:

1

No. of Functions:

3

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

FHP3350IMTC14X General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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