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FCU4300N80Z

Onsemi

FCU4300N80Z by Onsemi

FCU4300N80Z by Onsemi is a N-CHANNEL Power FET with 800V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max Pulsed Drain Current of 3.2A, Avalanche Energy Rating of 8.2mJ, and Max Power Dissipation of 27.8W. Operating in ENHANCEMENT MODE, it has a Turn On Time of 53ns and Turn Off Time of 94ns, suitable for high-power switching circuits.

Median Price

$0.702

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,089 parts In-Stock

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$0.097

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1,089

$0.097

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Chip1Stop

Japan . 1,089 parts In-Stock

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$0.906

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1,089

$0.906

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Rochester

USA . 8,758 parts In-Stock

1+ parts

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$0.702

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$0.583

10k+ parts

$0.519

8,758

-

$0.702

$0.583

$0.519

Verical

USA . 1,089 parts In-Stock

1+ parts

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$0.097

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1,089

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$0.097

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DigiKey

USA . 658 parts In-Stock

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$0.880

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658

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$0.880

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Distributors (In-Stock)

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Digiode

USA . 765 parts In-Stock

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$0.092

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765

$0.092

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Vyrian

USA . 2,053 parts In-Stock

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$0.097

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2,053

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Flip Electronics

USA . 6,957 parts In-Stock

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6,957

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DigiKey Marketplace

USA . 1,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,326 parts In-Stock

1+ parts

$0.087

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2,326

$0.087

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Corohmni

South Africa . 346 parts In-Stock

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$0.097

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346

$0.097

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Northwest PG Solutions

USA . 693 parts In-Stock

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$2.696

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Perfect Parts

USA . 67,506 parts In-Stock

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GreenTree Electronics

Israel . 8,994 parts In-Stock

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Problanco Electronics

Mexico . 7,374 parts In-Stock

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Microchip USA

USA . 6,435 parts In-Stock

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TANS Electronics

Latvia . 6,062 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 3,862 parts In-Stock

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SupplyDigital Components

Austria . 3,700 parts In-Stock

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Supply Digital

USA . 2,460 parts In-Stock

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Native Components

USA . 34 parts In-Stock

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UHIMA Technologies

Türkiye . 31 parts In-Stock

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Overview

The FCU4300N80Z by Onsemi is a top-quality Power Field Effect Transistor that offers exceptional performance and reliability. With a focus on innovation and excellence, Onsemi delivers products that exceed industry standards. Ideal for switching applications, this N-CHANNEL transistor provides customers with a cost-effective solution that ensures efficient operation and long-term durability. Experience the value and benefits of the FCU4300N80Z for yourself and discover why Onsemi is a trusted name in the semiconductor industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have lower ON resistance and higher efficiency, making them ideal for switching applications.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this FET can handle high voltage applications with ease.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low ON resistance.

Maximum Power Dissipation (Abs): 27.8 W

The high power dissipation rating allows the FET to handle higher power loads without overheating.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can operate reliably in high-temperature environments.

Maximum Turn Off Time (toff): 94 ns

The fast turn-off time ensures efficient switching performance and minimizes power loss during switching transitions.

Technical Specifications

Power Field Effect Transistors (FET) FCU4300N80Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

8.2 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

1.6 A

Maximum Drain Current (ID):

1.6 A

Maximum Drain-Source On Resistance:

4.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

3.2 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

94 ns

Maximum Turn On Time (ton):

53 ns

Trade Compliance

FCU4300N80Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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