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FCH25N60N

Onsemi

FCH25N60N by Onsemi

FCH25N60N by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage, 75A IDM, and 0.126 ohm RDS(on). Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 216W and operates at up to 150°C.

Median Price

$4.260

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 17 parts In-Stock

1+ parts

$6.630

100+ parts

$4.310

1k+ parts

$3.420

10k+ parts

$3.120

17

$6.630

$4.310

$3.420

$3.120

RS (Exports)

UK . 401 parts In-Stock

1+ parts

$6.799

100+ parts

$5.352

1k+ parts

$4.648

10k+ parts

-

401

$6.799

$5.352

$4.648

-

Rochester

USA . 7,013 parts In-Stock

1+ parts

-

100+ parts

$3.240

1k+ parts

$2.900

10k+ parts

$2.730

7,013

-

$3.240

$2.900

$2.730

DigiKey

USA . 6,788 parts In-Stock

1+ parts

-

100+ parts

$4.260

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-

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6,788

-

$4.260

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Verical

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

$4.050

1k+ parts

$3.625

10k+ parts

$3.413

3,500

-

$4.050

$3.625

$3.413

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,784 parts In-Stock

1+ parts

$3.430

100+ parts

-

1k+ parts

-

10k+ parts

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1,784

$3.430

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-

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Vyrian

USA . 2,696 parts In-Stock

1+ parts

$3.610

100+ parts

-

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-

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2,696

$3.610

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Nova Conductors

Japan . 79 parts In-Stock

1+ parts

-

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-

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79

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,053 parts In-Stock

1+ parts

$3.070

100+ parts

-

1k+ parts

-

10k+ parts

-

3,053

$3.070

-

-

-

Corphita

USA . 1,496 parts In-Stock

1+ parts

$3.249

100+ parts

-

1k+ parts

-

10k+ parts

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1,496

$3.249

-

-

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Corohmni

South Africa . 94 parts In-Stock

1+ parts

$3.610

100+ parts

-

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94

$3.610

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-

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Microchip USA

USA . 201 parts In-Stock

1+ parts

$22.490

100+ parts

-

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201

$22.490

-

-

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A-Z Elektronik GmbH

Germany . 11,985 parts In-Stock

1+ parts

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11,985

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Lixinc

USA . 10,749 parts In-Stock

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10,749

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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TANS Electronics

Latvia . 4,944 parts In-Stock

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4,944

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Kepictronics

USA . 4,500 parts In-Stock

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4,500

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Alle Elektronik GmbH

Germany . 4,090 parts In-Stock

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4,090

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Kulean Microsystems

USA . 3,800 parts In-Stock

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3,800

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Problanco Electronics

Mexico . 3,733 parts In-Stock

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3,733

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Supply Digital

USA . 1,422 parts In-Stock

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1,422

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SupplyDigital Components

Austria . 1,229 parts In-Stock

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1,229

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Perfect Parts

USA . 1,008 parts In-Stock

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1,008

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UHIMA Technologies

Türkiye . 598 parts In-Stock

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598

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RC Electronics

USA . 280 parts In-Stock

1+ parts

-

100+ parts

$4.570

1k+ parts

$4.310

10k+ parts

$4.220

280

-

$4.570

$4.310

$4.220

iodParts Technologies Inc.

India . 97 parts In-Stock

1+ parts

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97

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Overview

Unlock the full potential of your power applications with the FCH25N60N by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in all their products. The FCH25N60N is a powerhouse in the realm of Power Field Effect Transistors (FET), offering enhanced switching capabilities and a high breakdown voltage of 600V. With a maximum pulsing drain current of 75A, this N-channel transistor is perfect for various switching applications. Experience the exceptional performance and efficiency this product brings, making it an invaluable asset to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the FET, ensuring long-term reliable performance.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications without risk of damage or failure.

Maximum Pulsed Drain Current (IDM): 75 A

The high pulsed drain current rating allows this FET to handle peak loads and transient currents effectively.

Maximum Power Dissipation (Abs): 216 W

With a high power dissipation rating, this FET can efficiently handle heat dissipation, making it suitable for high-power applications.

Maximum Operating Temperature: 150 °C

The high operating temperature rating ensures that this FET can handle elevated temperatures without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) FCH25N60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

861 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.126 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

75 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCH25N60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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