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FAN3850TUC15X35

Onsemi

FAN3850TUC15X35 by Onsemi

FAN3850TUC15X35 by Onsemi is a consumer IC with 6 terminals, operating voltage range of 1.64V to 3.63V, and CMOS technology. It features a very thin profile grid array package suitable for various consumer circuit applications requiring precise power supplies in the temperature range of -30 °C to 85°C.

Median Price

$0.252

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 70 parts In-Stock

1+ parts

$1.181

100+ parts

$1.075

1k+ parts

$0.968

10k+ parts

-

70

$1.181

$1.075

$0.968

-

DigiKey

USA . 167,633 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.280

167,633

-

-

-

$0.280

Rochester

USA . 166,895 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

166,895

-

$0.225

$0.186

$0.166

Verical

USA . 156,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.208

156,723

-

-

-

$0.208

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,332 parts In-Stock

1+ parts

$0.175

100+ parts

-

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2,332

$0.175

-

-

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Vyrian

USA . 1,398 parts In-Stock

1+ parts

$0.184

100+ parts

-

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-

10k+ parts

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1,398

$0.184

-

-

-

Bristol Electronics

USA . 919 parts In-Stock

1+ parts

$0.690

100+ parts

$0.276

1k+ parts

$0.193

10k+ parts

-

919

$0.690

$0.276

$0.193

-

ACDS - Activité Composants Distribution Service

France . 919 parts In-Stock

1+ parts

-

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919

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Dan-Mar Components

USA . 919 parts In-Stock

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919

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 876 parts In-Stock

1+ parts

$0.103

100+ parts

-

1k+ parts

-

10k+ parts

$0.098

876

$0.103

-

-

$0.098

Northwest PG Solutions

USA . 2,375 parts In-Stock

1+ parts

$0.113

100+ parts

-

1k+ parts

-

10k+ parts

$0.100

2,375

$0.113

-

-

$0.100

Corphita

USA . 2,178 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

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2,178

$0.166

-

-

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Corohmni

South Africa . 496 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

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10k+ parts

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496

$0.184

-

-

-

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$1.181

100+ parts

$1.075

1k+ parts

$0.968

10k+ parts

-

70

$1.181

$1.075

$0.968

-

Andel Nordic

Denmark . 3,150 parts In-Stock

1+ parts

$5.005

100+ parts

-

1k+ parts

$4.805

10k+ parts

$4.805

3,150

$5.005

-

$4.805

$4.805

QUARKTWIN TECHNOLOGY LTD

USA . 15,470 parts In-Stock

1+ parts

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15,470

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Perfect Parts

USA . 9,281 parts In-Stock

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9,281

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Kulean Microsystems

USA . 4,232 parts In-Stock

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4,232

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Microchip USA

USA . 4,185 parts In-Stock

1+ parts

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4,185

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SupplyDigital Components

Austria . 3,457 parts In-Stock

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3,457

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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3,000

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Supply Digital

USA . 2,244 parts In-Stock

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2,244

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A-Z Elektronik GmbH

Germany . 1,503 parts In-Stock

1+ parts

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1,503

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-

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Alle Elektronik GmbH

Germany . 1,002 parts In-Stock

1+ parts

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1,002

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TANS Electronics

Latvia . 944 parts In-Stock

1+ parts

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944

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Problanco Electronics

Mexico . 690 parts In-Stock

1+ parts

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690

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UHIMA Technologies

Türkiye . 622 parts In-Stock

1+ parts

-

100+ parts

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622

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-

Overview

Discover the innovative FAN3850TUC15X35 by Onsemi, a top-quality consumer circuit IC that promises reliability and superior performance. With a sleek rectangular shape and surface mount design, this product is perfect for a wide range of applications. From enhancing electronic devices to optimizing power supplies, this IC offers tremendous value and benefits to customers. Trust in Onsemi's renowned reputation for manufacturing excellence and invest in the FAN3850TUC15X35 for all your circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, making it suitable for various consumer electronic applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Power Supplies (V): 1.8

Operates on a low power supply voltage of 1.8V, making it energy-efficient and suitable for battery-powered devices.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high speed, and noise immunity, making it an excellent choice for consumer circuit applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand harsh environmental conditions, ensuring reliable performance.

Minimum Operating Temperature: -30 °C

Capable of operating in low temperatures as low as -30 °C, making it suitable for a wide range of operating environments.

Technical Specifications

Other Function Consumer ICs FAN3850TUC15X35 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e1

Length:

1.26 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

.3 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

1.64 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.485 mm

Terminal Position:

BOTTOM

Width:

.86 mm

Trade Compliance

FAN3850TUC15X35 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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