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FAN3850AUC16X

Onsemi

FAN3850AUC16X by Onsemi

FAN3850AUC16X by Onsemi is a consumer IC with 6 terminals, operating voltage range of 1.64V to 3.63V, and CMOS technology. It comes in a rectangular plastic/epoxy package with grid array style suitable for consumer circuit applications requiring low power supplies and compact design. Operating temperature ranges from -30 °C to 85°C making it ideal for various electronic devices.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,264 parts In-Stock

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$0.300

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Digiode

USA . 1,506 parts In-Stock

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Netsource Technology, Inc.

USA . 775 parts In-Stock

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775

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Chip Stock

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149

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Metaverse IC Inc.

Canada . 68,391 parts In-Stock

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Perfect Parts

USA . 58,968 parts In-Stock

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TANS Electronics

Latvia . 7,860 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,779 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,624 parts In-Stock

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Kulean Microsystems

USA . 5,442 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,519 parts In-Stock

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Problanco Electronics

Mexico . 4,017 parts In-Stock

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Corphita

USA . 2,283 parts In-Stock

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Northwest PG Solutions

USA . 2,281 parts In-Stock

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SupplyDigital Components

Austria . 961 parts In-Stock

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Supply Digital

USA . 707 parts In-Stock

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Microchip USA

USA . 368 parts In-Stock

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368

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Native Components

USA . 352 parts In-Stock

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352

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Corohmni

South Africa . 127 parts In-Stock

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UHIMA Technologies

Türkiye . 50 parts In-Stock

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50

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Overview

Experience the superior quality and reliability of Onsemi with the FAN3850AUC16X. This cutting-edge consumer circuit IC offers a wide range of applications, delivering exceptional performance in various electronic devices. With a focus on value and customer satisfaction, this product provides unmatched benefits and advantages. Trust Onsemi to provide top-notch solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides a lightweight and durable package for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Power Supplies (V): 1.8

Operates on a low voltage of 1.8V, making it energy efficient and suitable for portable electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures stable performance even in demanding and harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable in various applications.

Technical Specifications

Other Function Consumer ICs FAN3850AUC16X attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e1

Length:

1.26 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

.3 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

1.64 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.485 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.86 mm

Trade Compliance

FAN3850AUC16X General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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