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F59318969D

Onsemi

F59318969D by Onsemi

F59318969D by Onsemi is a Power Management IC with 19 terminals, operating from -40 to 120 °C. It features an adjustable threshold voltage of +2.80V and is ideal for industrial applications requiring power supply support circuits in a rectangular package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,135 parts In-Stock

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Digiode

USA . 2,151 parts In-Stock

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Northwest PG Solutions

USA . 984 parts In-Stock

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$3.180

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$3.180

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AZTECH Wire

Italy . 397 parts In-Stock

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$8.470

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QUARKTWIN TECHNOLOGY LTD

USA . 24,694 parts In-Stock

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SupplyDigital Components

Austria . 5,081 parts In-Stock

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Problanco Electronics

Mexico . 4,656 parts In-Stock

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Microchip USA

USA . 4,460 parts In-Stock

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Kulean Microsystems

USA . 3,472 parts In-Stock

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Corphita

USA . 1,506 parts In-Stock

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UHIMA Technologies

Türkiye . 815 parts In-Stock

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TANS Electronics

Latvia . 692 parts In-Stock

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Native Components

USA . 613 parts In-Stock

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Corohmni

South Africa . 63 parts In-Stock

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Overview

Enhance the performance of your power management systems with the F59318969D by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that are designed to optimize efficiency and reliability. This versatile product is perfect for a wide range of applications, providing customers with enhanced control and precision in their power supply support circuits. With an adjustable threshold and industrial-grade temperature tolerance, the F59318969D offers exceptional value and benefits to help you achieve seamless power management solutions. Elevate your systems with Onsemi's innovative technology today.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic devices.

No. of Terminals: 19

Having 19 terminals provides ample connectivity options for different components in a circuit.

Package Style: MICROELECTRONIC ASSEMBLY

The microelectronic assembly style enhances the compactness and efficiency of the product.

Maximum Operating Temperature: 120 °C

With a high maximum operating temperature, this product can withstand extreme conditions and ensures reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of environments without compromising performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and connection of the IC.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC contributes to the efficient operation and management of power in electronic devices.

Nominal Threshold Voltage (V): +2.80V

The nominal threshold voltage of +2.80V ensures proper functioning and protection of the connected components within the specified voltage range.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh operating conditions and ensure long-term performance.

Adjustable Threshold: YES

The ability to adjust the threshold voltage adds versatility and customization options for different system requirements.

Technical Specifications

Power Management ICs F59318969D attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XDFM-X19

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

19

Maximum Operating Temperature:

120 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DFM

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Surface Mount:

NO

Temperature Grade:

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.80V

Trade Compliance

F59318969D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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