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E7150-102A49-AG

Onsemi

E7150-102A49-AG by Onsemi

E7150-102A49-AG by Onsemi is a consumer circuit IC with 49 terminals in a rectangular grid array package. It operates b/w -40 to 85 °C, with supply voltage ranging from 1.05V to 2V. Ideal for industrial applications requiring fine pitch surface mount technology.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,780 parts In-Stock

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6,780

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Digiode

USA . 2,151 parts In-Stock

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2,151

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Distributors (Availability)

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Native Components

USA . 199 parts In-Stock

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$0.787

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199

$0.787

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Northwest PG Solutions

USA . 331 parts In-Stock

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$0.866

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331

$0.866

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Corohmni

South Africa . 584 parts In-Stock

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$1.086

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584

$1.086

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$1.975

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$1.797

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$1.620

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15

$1.975

$1.797

$1.620

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AZTECH Wire

Italy . 766 parts In-Stock

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$18.580

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766

$18.580

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Problanco Electronics

Mexico . 8,304 parts In-Stock

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SupplyDigital Components

Austria . 7,064 parts In-Stock

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Microchip USA

USA . 2,446 parts In-Stock

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2,446

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Kulean Microsystems

USA . 1,049 parts In-Stock

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Corphita

USA . 834 parts In-Stock

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834

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TANS Electronics

Latvia . 602 parts In-Stock

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602

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UHIMA Technologies

Türkiye . 237 parts In-Stock

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Overview

Unleash the power of innovation with the E7150-102A49-AG by Onsemi. Crafted with precision and expertise, this consumer circuit IC offers unparalleled quality and reliability. Whether you're looking to enhance your electronics, automotive systems, or industrial applications, this versatile product is designed to exceed expectations. With a wide operating temperature range and advanced features, it delivers exceptional performance and value to customers. Upgrade your projects with confidence and elevate your creations to new heights with the E7150-102A49-AG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the IC, making it suitable for consumer use.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient installation on circuit boards, saving time and effort.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding environments.

Minimum Supply Voltage (Vsup): 1.05 V

The low minimum supply voltage requirement of 1.05 V helps in reducing power consumption and is ideal for battery-powered consumer devices.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating signifies that this IC can withstand harsh conditions and is suitable for a wide range of applications.

Technical Specifications

Other Function Consumer ICs E7150-102A49-AG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Additional Features:

IT ALSO HAS OPERATING TEMPERATURE 0 TO 50

General IC Type:

JESD-30 Code:

R-PBGA-B49

Length:

7.39 mm

No. of Functions:

1

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.778 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.05 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.686 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.94 mm

Trade Compliance

E7150-102A49-AG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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