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CSPEMI307AG

Onsemi

CSPEMI307AG by Onsemi

CSPEMI307AG by Onsemi is a Data Line Filter with 4 functions and 15 terminals. It has a max operating temperature of 85 °C, DC resistance of 120 ohm, and output impedance of 50 ohm. Ideal for IEC-approved applications requiring filtering in compact dimensions (L3.005XB1.375XH0.649 mm).

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

USA . 54,000 parts In-Stock

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BCID Electronics Ltd.

Israel . 1,910 parts In-Stock

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Vyrian

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Digiode

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Native Components

USA . 246 parts In-Stock

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Northwest PG Solutions

USA . 1,057 parts In-Stock

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Kepictronics

USA . 42,000 parts In-Stock

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TANS Electronics

Latvia . 7,002 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Kulean Microsystems

USA . 3,522 parts In-Stock

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UHIMA Technologies

Türkiye . 962 parts In-Stock

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SupplyDigital Components

Austria . 905 parts In-Stock

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Corphita

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Corohmni

South Africa . 421 parts In-Stock

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Problanco Electronics

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Overview

Enhance the performance of your electronic devices with the CSPEMI307AG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Data Line Filters that are IEC approved and offer 4 functions with 15 terminals. Designed to optimize data transmission and protect against interference, this product ensures reliable operation in a wide range of applications. With a maximum operating temperature of 85 °C and a compact size, the CSPEMI307AG provides exceptional value and benefits to customers seeking high-performance filtering solutions. Trust Onsemi for superior quality and unmatched performance.

Feature Benefit Bullets

Approvals (V) IEC

Having IEC approvals ensures that the product meets international standards for safety and quality.

No. of Functions

Having multiple functions means this data line filter can offer comprehensive filtering of various types of interference.

Filter Type

Being a data line filter means it is specifically designed to protect data lines from interference, making it ideal for data-sensitive applications.

Maximum Operating Temperature

With a high maximum operating temperature of 85 °C, this filter can withstand harsh conditions without compromising performance.

Terminal Finish

The tin/silver/copper finish ensures good connectivity and durability of the terminals.

Width (mm)

The narrow width of 1.375mm makes it suitable for compact electronic devices where space is limited.

Maximum DC Resistance

The low resistance of 120 ohms helps in maintaining signal integrity by minimizing signal loss.

Output Impedance (ohm)

The output impedance of 50 ohms matches standard impedance levels, ensuring optimal signal transmission.

Mounting Type

The surface mount design makes it easy to integrate into circuit boards, saving space and simplifying assembly.

Height

The low height of 0.649mm allows for a slim profile and easy integration into compact electronic devices.

Capacitance

The capacitance of 30 uF helps in filtering out high-frequency noise and interference from data lines, ensuring clean signal transmission.

Technical Specifications

Data Line Filters CSPEMI307AG attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Additional Features:

PI-TYPE CIRCUIT

Approvals (V):

IEC

Capacitance:

30 uF

Maximum DC Resistance:

Filter Type:

Height:

.649 mm

JESD-609 Code:

e1

Length:

3.005 mm

Mounting Type:

SURFACE MOUNT

No. of Functions:

4

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Impedance (ohm):

50 OHM

Package Material:

PLASTIC

Packing Method:

TAPE AND REEL

Dimensions:

L3.005XB1.375XH0.649 (mm)/L0.118XB0.054XH0.026 (inch)

Sub-Category:

Data Line Filters

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Width (mm):

1.375

Trade Compliance

CSPEMI307AG Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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