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CS8182DTRKG

Onsemi

CS8182DTRKG by Onsemi

ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR; No. of Terminals: 4; Terminal Form: GULL WING; Maximum Input Voltage Absolute: 45 V; Peak Reflow Temperature (C): NOT SPECIFIED; No. of Functions: 1;

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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EBV Elektronik

Germany . 7,500 parts In-Stock

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Vyrian

USA . 7,252 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2,620 parts In-Stock

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Digiode

USA . 2,267 parts In-Stock

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Flip Electronics

USA . 2,000 parts In-Stock

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Native Components

USA . 284 parts In-Stock

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$0.628

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Northwest PG Solutions

USA . 1,216 parts In-Stock

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$0.691

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AZTECH Wire

Italy . 413 parts In-Stock

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$10.240

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Component Stockers USA

USA . 605 parts In-Stock

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$99.990

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RC Electronics

USA . 34,167 parts In-Stock

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Perfect Parts

USA . 20,338 parts In-Stock

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TANS Electronics

Latvia . 6,958 parts In-Stock

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Kulean Microsystems

USA . 5,933 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 4,479 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Corphita

USA . 897 parts In-Stock

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SupplyDigital Components

Austria . 766 parts In-Stock

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UHIMA Technologies

Türkiye . 442 parts In-Stock

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Corohmni

South Africa . 414 parts In-Stock

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Microchip USA

USA . 249 parts In-Stock

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FE SAS

France . 6 parts In-Stock

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Technical Specifications

Adjustable Regulators - Positive Single Output LDO CS8182DTRKG attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.35 V

Maximum Input Voltage Absolute:

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Length:

6.54 mm

Maximum Line Regulation (%/V):

.023

Maximum Load Regulation (%):

.5 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Maximum Output Voltage-1:

45 V

Minimum Output Voltage-1:

2.8 V

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP5H,.37,50TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification Status:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.14 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.095 mm

Trade Compliance

CS8182DTRKG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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