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CS8182YDPS5

Onsemi

CS8182YDPS5 by Onsemi

CS8182YDPS5 by Onsemi is an adjustable positive single output LDO regulator with a max output voltage of 45V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125 °C, making it suitable for various applications requiring precise voltage regulation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,714 parts In-Stock

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Digiode

USA . 1,307 parts In-Stock

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Native Components

USA . 391 parts In-Stock

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$0.518

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Northwest PG Solutions

USA . 2,307 parts In-Stock

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$0.569

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Component Stockers USA

USA . 465 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 5,920 parts In-Stock

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Problanco Electronics

Mexico . 5,741 parts In-Stock

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TANS Electronics

Latvia . 4,753 parts In-Stock

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Corphita

USA . 2,007 parts In-Stock

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UHIMA Technologies

Türkiye . 762 parts In-Stock

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SupplyDigital Components

Austria . 745 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 323 parts In-Stock

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Overview

Unleash the power of reliable and efficient voltage regulation with the CS8182YDPS5 by Onsemi. Crafted by a trusted manufacturer, this adjustable positive single output LDO regulator offers unparalleled quality and performance. Perfect for a wide range of applications, this product provides stable and consistent power output, ensuring optimal functionality for your devices. Say goodbye to voltage fluctuations and hello to seamless operation with the CS8182YDPS5 - your go-to solution for dependable power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Maximum Dropout Voltage-1: 1.6 V

Low dropout voltage ensures efficient power conversion with minimal energy loss.

Surface Mount: YES

Surface mount capability enables easy integration onto PCBs, saving space and simplifying assembly.

Operating Temperature (TJ-Max): 125 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Technology: BIPOLAR

Bipolar technology offers stable and accurate voltage regulation for consistent power output.

Package Shape: RECTANGULAR

Rectangular shape facilitates compact packaging and efficient use of space on circuit boards.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections, reducing the risk of disconnections.

Operating Temperature (TJ-Min): -40 °C

Low minimum operating temperature allows for operation even in extreme cold environments.

Packing Method: RAIL

Rail packing method simplifies handling and storage of multiple units during manufacturing and distribution.

Minimum Output Voltage-1: 2.8 V

Minimum output voltage of 2.8V suits a wide range of applications requiring lower voltage levels.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO CS8182YDPS5 attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.35 V

Maximum Input Voltage Absolute:

JESD-30 Code:

R-PSSO-G5

JESD-609 Code:

e0

Length:

10.18 mm

Maximum Line Regulation (%/V):

.023

Maximum Load Regulation (%):

.5 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Maximum Output Voltage-1:

45 V

Minimum Output Voltage-1:

2.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Maximum Seated Height:

4.82 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Width:

8.51 mm

Trade Compliance

CS8182YDPS5 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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