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CS5303GDW28

Onsemi

CS5303GDW28 by Onsemi

CS5303GDW28 by Onsemi is a 28-terminal switching controller with PWM control mode. It operates b/w 0-70 °C, ideal for commercial applications. With a max output current of 1.5A and switch frequency of 1000kHz, it's suitable for compact designs requiring precise voltage regulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,220 parts In-Stock

1+ parts

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2,220

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Vyrian

USA . 2,076 parts In-Stock

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2,076

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 888 parts In-Stock

1+ parts

$0.186

100+ parts

-

1k+ parts

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10k+ parts

$0.178

888

$0.186

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$0.178

Northwest PG Solutions

USA . 141 parts In-Stock

1+ parts

$0.204

100+ parts

-

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$0.180

141

$0.204

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$0.180

Advanced Electronics

New Zealand . 3,710 parts In-Stock

1+ parts

$26.825

100+ parts

$26.557

1k+ parts

$25.484

10k+ parts

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3,710

$26.825

$26.557

$25.484

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Problanco Electronics

Mexico . 8,064 parts In-Stock

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8,064

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Kulean Microsystems

USA . 4,682 parts In-Stock

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4,682

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TANS Electronics

Latvia . 2,587 parts In-Stock

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2,587

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Corphita

USA . 1,109 parts In-Stock

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1,109

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UHIMA Technologies

Türkiye . 955 parts In-Stock

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955

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SupplyDigital Components

Austria . 284 parts In-Stock

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284

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Corohmni

South Africa . 187 parts In-Stock

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187

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Overview

Discover the CS5303GDW28 by Onsemi, a cutting-edge switching regulator & controller that offers unparalleled quality and reliability. Manufactured by Onsemi, a renowned leader in the industry, this product provides exceptional performance in a wide range of applications. From power management to voltage regulation, this versatile component is designed to optimize efficiency and enhance overall system performance. Say goodbye to subpar products and experience the value and benefits that the CS5303GDW28 brings to your projects. Trust in Onsemi for superior quality and unmatched innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for a wide range of applications.

Surface Mount: YES

Easy to mount on PCBs, saves space and simplifies assembly process.

No. of Terminals: 28

Sufficient number of terminals for a versatile and customizable circuit design.

Control Mode: CURRENT/VOLTAGE-MODE

Provides flexibility in controlling the output voltage and current for different applications.

Nominal Input Voltage: 5 V

Optimal input voltage for efficient power conversion and compatibility with standard power sources.

Maximum Output Current: 1.5 A

Capable of delivering high output current for powering various devices or components.

Technical Specifications

Switching Regulators & Controllers CS5303GDW28 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

ALSO REQUIRES A SUPPLY OF 8V TO 20V

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14 V

Minimum Input Voltage:

4.7 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

17.925 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

1000 kHz

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

CS5303GDW28 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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