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CS5302GDW28

Onsemi

CS5302GDW28 by Onsemi

CS5302GDW28 by Onsemi is a 28-terminal switching controller with max output current of 1.5A and max switching frequency of 1000kHz. It operates b/w 0-70 °C, ideal for commercial applications requiring pulse width modulation control technique in small outline packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 284 parts In-Stock

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Digiode

USA . 179 parts In-Stock

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179

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Distributors (Availability)

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Native Components

USA . 739 parts In-Stock

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$0.229

100+ parts

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$0.220

739

$0.229

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$0.220

Northwest PG Solutions

USA . 693 parts In-Stock

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$0.252

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$0.222

693

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$0.222

A-Z Elektronik GmbH

Germany . 7,385 parts In-Stock

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7,385

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Kulean Microsystems

USA . 7,358 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,923 parts In-Stock

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TANS Electronics

Latvia . 4,909 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Problanco Electronics

Mexico . 2,651 parts In-Stock

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SupplyDigital Components

Austria . 2,558 parts In-Stock

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Corphita

USA . 806 parts In-Stock

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UHIMA Technologies

Türkiye . 704 parts In-Stock

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Corohmni

South Africa . 426 parts In-Stock

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Overview

Experience superior performance and reliability with the CS5302GDW28 from Onsemi. As a leading manufacturer in the industry, Onsemi's switching regulators & controllers are designed for efficiency and precision. With a small outline package and dual terminal position, this product offers convenience and ease of use. Ideal for a wide range of applications, this switching controller provides a maximum output current of 1.5 A and a maximum switching frequency of 1000 kHz. Trust Onsemi to deliver quality products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

No. of Terminals: 28

Having a larger number of terminals allows for more connections and flexibility in circuit design.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can handle demanding conditions without overheating.

Control Mode: CURRENT/VOLTAGE-MODE

This control mode offers versatile functionality for regulating both current and voltage, making the product suitable for a variety of applications.

Maximum Output Current: 1.5 A

The high maximum output current capability allows the product to power devices that require higher levels of current, increasing its versatility.

Technical Specifications

Switching Regulators & Controllers CS5302GDW28 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

ALSO REQUIRES 10V TO 20V SUPPLY

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14 V

Minimum Input Voltage:

4.7 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

17.925 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

1000 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

CS5302GDW28 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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