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CS5301GDW32G

Onsemi

CS5301GDW32G by Onsemi

CS5301GDW32G by Onsemi is a 32-terminal switching controller with voltage-mode control technique. It operates b/w 0-70 °C, has a max output current of 1.5A, and supports PWM with a max frequency of 1000 kHz. Ideal for applications requiring small outline packages and high switching frequencies.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,912 parts In-Stock

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Digiode

USA . 483 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 7 parts In-Stock

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Native Components

USA . 451 parts In-Stock

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$5.240

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Corohmni

South Africa . 108 parts In-Stock

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$9.720

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AZTECH Wire

Italy . 454 parts In-Stock

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$20.160

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Advanced Electronics

New Zealand . 29 parts In-Stock

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$21.189

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$19.282

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$17.375

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Component Stockers USA

USA . 540 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 7,214 parts In-Stock

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Microchip USA

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TANS Electronics

Latvia . 5,329 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,676 parts In-Stock

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Metaverse IC Inc.

Canada . 3,949 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,117 parts In-Stock

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Kulean Microsystems

USA . 2,898 parts In-Stock

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SupplyDigital Components

Austria . 2,176 parts In-Stock

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Northwest PG Solutions

USA . 1,303 parts In-Stock

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Problanco Electronics

Mexico . 269 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 111 parts In-Stock

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Overview

Discover the CS5301GDW32G by Onsemi, a cutting-edge Switching Regulator & Controller that offers unparalleled quality and reliability. Manufactured by industry leader Onsemi, this product is designed to meet the highest standards in performance and efficiency. With a wide range of applications, from industrial automation to consumer electronics, this device delivers exceptional value and benefits to customers. Experience the advantages of advanced control techniques and high switching frequencies, all in a compact and durable package. Upgrade your system with the CS5301GDW32G and unleash its full potential today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the switching regulator, ensuring reliability in various operating conditions.

Surface Mount: YES

Facilitates easy and efficient assembly onto circuit boards, saving time and effort during manufacturing processes.

Control Mode: VOLTAGE-MODE

Offers precise control over output voltage levels, making it ideal for applications where stable voltage regulation is essential.

Maximum Output Current: 1.5 A

Capable of delivering sufficient power for various electronic devices and components, suitable for medium power applications.

Maximum Switching Frequency: 1000 kHz

High switching frequency enables efficient power conversion with minimal energy loss, increasing overall efficiency of the switching regulator.

Technical Specifications

Switching Regulators & Controllers CS5301GDW32G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

CURRENT

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

14 V

Minimum Input Voltage:

4.7 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

20.725 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

1000 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

CS5301GDW32G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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