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CAT6500HVA-T2

Onsemi

CAT6500HVA-T2 by Onsemi

CAT6500HVA-T2 by Onsemi is a Power Management IC with 32 terminals, operating at -40 to 85 °C. It has a supply voltage range of 1.6V to 5.5V and supports power supply circuits in industrial applications. The chip carrier package style with a very thin profile makes it suitable for surface mount installations.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

USA . 3,355 parts In-Stock

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Bristol Electronics

USA . 645 parts In-Stock

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SPM Sales

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Digiode

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Northwest PG Solutions

USA . 364 parts In-Stock

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$3.569

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AZTECH Wire

Italy . 647 parts In-Stock

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Component Stockers USA

USA . 777 parts In-Stock

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$99.990

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 6,963 parts In-Stock

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Kulean Microsystems

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Problanco Electronics

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GreenTree Electronics

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SupplyDigital Components

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UHIMA Technologies

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Native Components

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Corphita

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Microchip USA

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Overview

Discover the power and efficiency of the CAT6500HVA-T2 by Onsemi. This high-quality Power Management IC is designed to meet the demands of various applications, providing a reliable solution for your power supply needs. With Onsemi's reputation for excellence in manufacturing, you can trust that this product offers superior performance and durability. Experience the benefits of seamless integration, precise power management, and optimal thermal performance. Upgrade your systems with the CAT6500HVA-T2 and enjoy the value it brings to your projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and making assembly more efficient.

Nominal Supply Voltage (Vsup): 3.9 V

Provides a stable voltage supply for the device, ensuring reliable performance.

No. of Terminals: 32

Offers a sufficient number of terminals for connecting various components and circuits, allowing for versatile application.

Maximum Operating Temperature: 85 °C

Can operate effectively at high temperatures, making it suitable for industrial applications or harsh environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, providing flexibility in operating conditions.

Width (mm): 4.4 mm

Compact size allows for integration into space-constrained designs.

Minimum Supply Voltage (Vsup): 1.6 V

Supports a wide range of input voltages, increasing compatibility with different power sources.

Terminal Form: NO LEAD

Lead-free terminals promote environmental friendliness and compliance with regulations.

Maximum Supply Voltage (Vsup): 5.5 V

Tolerant to higher supply voltages, offering protection against overvoltage conditions.

Technical Specifications

Power Management ICs CAT6500HVA-T2 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.9

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.12 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

3.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

CAT6500HVA-T2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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