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CAT5116ZI-T3

Onsemi

CAT5116ZI-T3 by Onsemi

CAT5116ZI-T3 by Onsemi is a digital potentiometer with 32000 ohm total resistance, 300 ppm/°C temp coefficient, and logarithmic resistance law. It is used in industrial applications for increment/decrement control interface, with 8 terminals and 100 positions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,205 parts In-Stock

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11,205

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Digiode

USA . 151 parts In-Stock

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151

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 2,293 parts In-Stock

1+ parts

$2.401

100+ parts

-

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2,293

$2.401

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AZTECH Wire

Italy . 1,201 parts In-Stock

1+ parts

$9.620

100+ parts

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1,201

$9.620

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Ampacity Inc.

Singapore . 311 parts In-Stock

1+ parts

$29.000

100+ parts

-

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311

$29.000

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Component Stockers USA

USA . 538 parts In-Stock

1+ parts

$99.990

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538

$99.990

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SupplyDigital Components

Austria . 7,569 parts In-Stock

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7,569

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Kulean Microsystems

USA . 6,621 parts In-Stock

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6,621

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Microchip USA

USA . 4,660 parts In-Stock

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4,660

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TANS Electronics

Latvia . 4,388 parts In-Stock

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4,388

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Corphita

USA . 2,223 parts In-Stock

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2,223

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Problanco Electronics

Mexico . 1,692 parts In-Stock

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1,692

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Native Components

USA . 283 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$2.118

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283

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$2.118

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Corohmni

South Africa . 206 parts In-Stock

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206

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UHIMA Technologies

Türkiye . 101 parts In-Stock

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101

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Overview

Upgrade your electronic designs with the CAT5116ZI-T3 by Onsemi, a top-quality digital potentiometer that offers precision and reliability. Manufactured by Onsemi, a trusted name in the industry, this DigiPOT is perfect for various applications, providing smooth control and excellent performance. With its incremental/decremental interface and 32,000 ohm total resistance, this compact device delivers unmatched value and benefits to customers. Trust Onsemi's expertise and choose the CAT5116ZI-T3 for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good resistance to environmental factors, making the product durable and reliable.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Nominal Temperature Coefficient: 300 ppm/°C

This low temperature coefficient ensures stable performance over a wide range of temperatures, making it suitable for various environments.

Package Shape: SQUARE

The square shape provides a compact design, ideal for applications where space is limited.

Control Interface: INCREMENT/DECREMENT

The ability to increment and decrement the resistance value simplifies the adjustment process and offers precise control.

Resistance Law: LOGARITHMIC

The logarithmic resistance law allows for more precise and smooth adjustment of resistance values, suitable for applications requiring fine-tuning.

Nominal Total Resistance: 32000 ohm

The high total resistance value provides flexibility in applications requiring a wide range of resistance values.

Maximum Resistor Terminal Voltage: 3 V

The high maximum terminal voltage ensures compatibility with a variety of power supplies, increasing the product's versatility.

Power Supplies (V): 3/5

Support for multiple power supply options allows for compatibility with different systems, enhancing the product's usability.

No. of Terminals: 8

The multiple terminals provide versatility in circuit connections and applications, making the product adaptable to various setups.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the circuit board, ideal for compact designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range enables the product to function reliably in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to operate in sub-zero environments without compromising performance.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and durability, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

The dual terminal position allows for flexible installation and connection options, accommodating different circuit layouts.

Maximum Seated Height: 1.1 mm

The low maximum seated height saves space in the overall design, suitable for slim and compact electronic devices.

Maximum Resistance Tolerance: 20 %

The high resistance tolerance provides room for variation in resistance values, ensuring consistent performance across different units.

Width: 3 mm

The compact width dimension is suitable for applications where space is limited, allowing for efficient placement on the circuit board.

No. of Positions: 100

The multiple positions offer a wide range of resistance settings, providing flexibility in adjusting the resistance value to meet specific requirements.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during the assembly process, leading to strong and durable connections.

Length: 3 mm

The compact length dimension is suitable for space-constrained applications, contributing to a more efficient and streamlined design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the product can operate reliably in demanding industrial environments, ensuring durability and stability.

Terminal Form: GULL WING

The gull wing terminal form provides secure and stable connections, making it suitable for applications where vibration or movement may occur.

Converter Type: DIGITAL POTENTIOMETER

The digital potentiometer offers precise digital control over resistance values, providing accuracy and repeatability in various applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V ensures compatibility with standard power sources, making it easy to integrate into existing circuits.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for compact placement of terminals on the circuit board, contributing to a more space-efficient design.

Minimum Resistor Terminal Voltage: 0 V

The ability to handle zero voltage at the resistor terminals ensures compatibility with a wide range of circuit configurations and power supplies.

Technical Specifications

Digital Potentiometers (DigiPOT) CAT5116ZI-T3 attributes and parameters. Explore more Digital Potentiometers (DigiPOT) devices from Onsemi

Converter Specifications

Sub-Category:

Digital Potentiometers

Resistance Law:

Logarithmic

Nominal Total Resistance:

32 KΩ

Control Interface:

Increment/Decrement

No. of Functions:

1

Maximum Resistance Tolerance:

20 %

Additional Features:

Nonvolatile memory

Electrical Characteristics

Nominal Supply Voltage:

3 V

Minimum Resistor Terminal Voltage:

0 V

Maximum Resistor Terminal Voltage:

3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Nominal Temperature Coefficient:

300 ppm/°C

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

1

Form Factor

Terminal Form:

Terminal Position:

Dual

No. of Terminals:

8

Terminal Finish:

Tin

Terminal Pitch:

0.026 in (0.65 mm)

No. of Positions:

100

Maximum Seated Height:

0.043 in (1.1 mm)

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Packaging

Package Shape:

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Trade Compliance

CAT5116ZI-T3 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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