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CAT34TS04VP2GT4A

Onsemi

CAT34TS04VP2GT4A by Onsemi

CAT34TS04VP2GT4A by Onsemi is a 12-bit temperature sensor with 2-wire interface. It operates b/w -20 to 125 °C, suitable for various applications requiring precise temperature monitoring. With a supply voltage range of 2.2V to 3.6V, it is ideal for compact designs in consumer electronics and industrial equipment.

Median Price

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Lifecycle Status

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In-Stock Inventory

1k+

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Vyrian

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Prism Electronics

USA . 2,685 parts In-Stock

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Digiode

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Native Components

USA . 739 parts In-Stock

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Northwest PG Solutions

USA . 909 parts In-Stock

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AZTECH Wire

Italy . 43 parts In-Stock

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RC Electronics

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Perfect Parts

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SupplyDigital Components

Austria . 3,215 parts In-Stock

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Corphita

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Problanco Electronics

Mexico . 1,622 parts In-Stock

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TANS Electronics

Latvia . 619 parts In-Stock

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UHIMA Technologies

Türkiye . 523 parts In-Stock

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Corohmni

South Africa . 476 parts In-Stock

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Kulean Microsystems

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Overview

Elevate your temperature sensing capabilities with the CAT34TS04VP2GT4A by Onsemi. Designed with precision and reliability in mind, this temperature sensor offers unparalleled accuracy and performance in a wide range of applications. From monitoring industrial processes to ensuring optimal thermal management in electronic devices, this sensor delivers consistent and reliable results. Trust Onsemi's reputation for quality and innovation to provide you with the tools you need to succeed. Explore the endless possibilities with the CAT34TS04VP2GT4A and experience the value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the sensor, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage which can improve the sensor's performance and accuracy.

No. of Bits: 12

Higher number of bits allows for more precise temperature readings and better resolution.

Power Supplies (V): 2.5/3.3

Flexible power supply options make it compatible with different systems and applications.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Versatile sensor types provide multiple output options and connectivity for various devices.

No. of Terminals: 8

Sufficient number of terminals for connecting the sensor securely and efficiently.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures reliable performance in extreme conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows the sensor to be used in cold environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The finish provides good conductivity and corrosion resistance for long-term reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Termination Type: SOLDER

Solder termination allows for secure and permanent connection of the sensor to the circuit.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies the connectivity of the sensor with other devices for data transmission.

Mounting Feature: SURFACE MOUNT

Surface mount option enables easy and secure mounting of the sensor on PCBs or other surfaces.

Technical Specifications

Temperature Sensors CAT34TS04VP2GT4A attributes and parameters. Explore more Temperature Sensors devices from Onsemi

Specs

Body Width:

2 inch

Body Height:

.75 mm

Body Length/Diameter:

3 mm

JESD-609 Code:

e4

Mounting Feature:

No. of Bits:

12

No. of Terminals:

8

Maximum Operating Current:

1 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-20 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SOLCC8,.11,20

Package Shape or Style:

Power Supplies (V):

2.5/3.3

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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