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TMP75BIDGKR

Texas Instruments

TMP75BIDGKR by Texas Instruments

TMP75BIDGKR by Texas Instruments is a 12-bit temperature sensor with a supply voltage range of 1.4V to 3.6V. It operates b/w -55°C to 125°C, featuring a 2-wire interface for digital output. Ideal for applications requiring precise temperature monitoring in compact spaces due to its small form factor and surface mount capability.

Median Price

$0.782

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Texas Instruments

USA . 8,034 parts In-Stock

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$0.771

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$0.312

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Arrow

USA . 1,960 parts In-Stock

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$0.959

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$0.782

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$0.611

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$0.959

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Mouser Electronics

USA . 1,102 parts In-Stock

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$1.240

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$0.894

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$0.798

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$0.684

1,102

$1.240

$0.894

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$0.684

Verical

USA . 1,960 parts In-Stock

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$0.782

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$0.611

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DigiKey

USA . 998 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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$0.686

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Digiode

USA . 3,111 parts In-Stock

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Chip Stock

USA . 22,390 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

UK . 3,270 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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Contempo Components LLC

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Microfarads

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$0.653

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$0.653

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$0.653

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2,000

$0.653

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Ampacity Inc.

Singapore . 5,933 parts In-Stock

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$0.660

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Semicontronic

India . 5,580 parts In-Stock

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$0.660

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$0.644

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$0.640

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Continental Prestige Electronics

USA . 2,865 parts In-Stock

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$0.663

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$0.650

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Argo Parts USA

USA . 413 parts In-Stock

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$0.663

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$0.643

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Netroflash

USA . 100 parts In-Stock

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$0.686

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$0.652

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$0.638

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$0.686

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Corphita

USA . 393 parts In-Stock

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$0.694

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Parana Technologies

USA . 810 parts In-Stock

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$1.378

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$127.942

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$1.240

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DigiPath Technology Company

USA . 404 parts In-Stock

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$1.517

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ChromeModa Solutions

Germany . 4,165 parts In-Stock

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$1.548

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$1.269

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IDEA Electronic Components Group

UK . 187 parts In-Stock

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Corohmni

South Africa . 119 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 1,535 parts In-Stock

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Kepictronics

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

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GreenTree Electronics

Israel . 270 parts In-Stock

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Overview

Enhance your temperature sensing capabilities with the TMP75BIDGKR by Texas Instruments. Crafted with precision and quality, this sensor offers unparalleled accuracy and reliability for a wide range of applications. From industrial to automotive settings, this versatile sensor provides real-time data with ease. Trust in Texas Instruments' reputation for excellence and invest in the TMP75BIDGKR for value, performance, and peace of mind. Upgrade your temperature sensing experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the sensor durable and resistant to environmental factors.

Maximum Supply Voltage: 3.6 V

With a high supply voltage, this sensor can be used in a variety of applications without risk of damage.

No. of Bits: 12

The high number of bits provides accurate and detailed temperature readings.

Body Width: 3 inch

The compact size of this sensor allows for easy integration into different systems.

Sensors or Transducers Type: TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

This versatile sensor can be used in various settings and applications.

Body Height: 1.1 mm

The low profile design of this sensor makes it suitable for space-constrained environments.

Package Shape or Style: SQUARE

The square shape allows for efficient placement and installation of the sensor.

Minimum Supply Voltage: 1.4 V

This low supply voltage ensures energy efficiency and prolongs the sensor's lifespan.

Maximum Operating Temperature: 125 °C

With a high operating temperature, this sensor can withstand extreme conditions.

Minimum Operating Temperature: -55 °C

The wide temperature range makes this sensor suitable for both hot and cold environments.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

The use of high-quality materials for terminal finish ensures reliable and long-lasting performance.

Maximum Operating Current: 0.089 mA

The low operating current helps conserve energy and reduces operational costs.

Housing: PLASTIC

The plastic housing provides insulation and protection for the sensor components.

Body Length/Diameter: 3 mm

The small size of the sensor allows for highly precise temperature measurements in confined spaces.

Termination Type: SOLDER

The solder termination ensures a secure and stable connection for accurate temperature readings.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the setup process and enhances compatibility with other systems.

Mounting Feature: SURFACE MOUNT

The surface mount design enables easy and secure installation of the sensor on various surfaces.

Technical Specifications

Temperature Sensors TMP75BIDGKR attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

1

Body Width:

3 inch

Body Height:

1.1 mm

Body Length/Diameter:

3 mm

Housing:

PLASTIC

JESD-609 Code:

e4

Mounting Feature:

No. of Bits:

12

Maximum Operating Current:

.089 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Shape or Style:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.4 V

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Termination Type:

SOLDER

Trade Compliance

TMP75BIDGKR Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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