Loading...

CAT24S64C4ATR

Onsemi

CAT24S64C4ATR by Onsemi

CAT24S64C4ATR by Onsemi is a 8KX8 EEPROM with 65536 bit memory density. It operates at 1 MHz clock frequency, has I2C serial bus type, and supports synchronous mode. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact grid array package.

Median Price

$0.250

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 32,631,472 parts In-Stock

1+ parts

-

100+ parts

$0.260

1k+ parts

$0.216

10k+ parts

$0.193

32,631,472

-

$0.260

$0.216

$0.193

Verical

USA . 17,810,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.241

17,810,000

-

-

-

$0.241

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.126

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.126

-

-

-

Digiode

USA . 1,232 parts In-Stock

1+ parts

$0.202

100+ parts

-

1k+ parts

-

10k+ parts

-

1,232

$0.202

-

-

-

Flip Electronics

USA . 155,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

155,000

-

-

-

-

Vyrian

USA . 6,351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,351

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.123

100+ parts

-

1k+ parts

$0.118

10k+ parts

-

100

$0.123

-

$0.118

-

Ampacity Inc.

Singapore . 32,633,630 parts In-Stock

1+ parts

$0.181

100+ parts

-

1k+ parts

-

10k+ parts

-

32,633,630

$0.181

-

-

-

Corphita

USA . 2,035 parts In-Stock

1+ parts

$0.192

100+ parts

-

1k+ parts

-

10k+ parts

-

2,035

$0.192

-

-

-

Corohmni

South Africa . 187 parts In-Stock

1+ parts

$0.213

100+ parts

-

1k+ parts

-

10k+ parts

-

187

$0.213

-

-

-

AZTECH Wire

Italy . 479 parts In-Stock

1+ parts

$15.940

100+ parts

-

1k+ parts

-

10k+ parts

-

479

$15.940

-

-

-

Authorized Procurement Solutions

USA . 22,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,000

-

-

-

-

Kepictronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Problanco Electronics

Mexico . 8,023 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,023

-

-

-

-

SupplyDigital Components

Austria . 6,844 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,844

-

-

-

-

Kulean Microsystems

USA . 3,771 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,771

-

-

-

-

TANS Electronics

Latvia . 2,831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,831

-

-

-

-

Microchip USA

USA . 1,211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,211

-

-

-

-

UHIMA Technologies

Türkiye . 113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

113

-

-

-

-

Overview

Unlock the power of reliable data storage with the CAT24S64C4ATR EEPROM by Onsemi. Manufactured with precision and expertise, this high-quality device offers unmatched performance and durability. Ideal for a wide range of applications, this EEPROM provides seamless operation in industrial settings. With its advanced technology and user-friendly design, customers can trust in the value and benefits that this product brings to their projects. Trust Onsemi to deliver excellence in every detail, choose the CAT24S64C4ATR for your EEPROM needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it a reliable choice for long-term use.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying installation.

Package Shape: SQUARE

Compact shape makes it easy to fit into tight spaces and design layouts efficiently.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures reliable and accurate data transfer, ideal for critical applications.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply ensures compatibility with most systems and power sources.

No. of Terminals: 4

Minimal terminals simplify connection and reduce the risk of errors during installation.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Innovative package style optimizes space utilization and enhances performance.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliability in various environmental conditions.

Organization: 8KX8

Organized memory layout facilitates efficient data management and access.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for use in extreme cold conditions without impacting performance.

Terminal Finish: TIN SILVER COPPER

Reliable terminal finish ensures stable connections and enhanced durability.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and connection processes.

Maximum Seated Height: 0.35 mm

Low profile design enables easy integration in compact spaces without sacrificing performance.

Maximum Clock Frequency (fCLK): 1 MHz

High clock frequency allows for fast data transfer speeds, ideal for time-sensitive applications.

Width: 0.85 mm

Slim width design saves space and allows for integration in small devices or systems.

Minimum Supply Voltage (Vsup): 1.7 V

Low minimum supply voltage ensures compatibility with a wide range of systems and power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and long-term reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure soldering connections and prevents damage during assembly.

Length: 0.85 mm

Compact length design allows for easy integration and versatility in layout configurations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

Parallel or Serial: SERIAL

Serial interface allows for simplified data transfer and communication protocols.

Terminal Form: BALL

Ball terminal form ensures secure connections and enhances durability in high-vibration environments.

No. of Words: 8192 words

Large word capacity allows for ample data storage and processing capabilities.

Memory Width: 8

Wide memory width accommodates various data types and enhances data processing efficiency.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for compact design integration and precise connections.

No. of Words Code: 8K

Clearly labeled word code simplifies data organization and retrieval processes.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance ensures compatibility with various power sources and systems.

Serial Bus Type: I2C

I2C serial bus type allows for easy integration and communication with other devices using a standardized protocol.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time enables quick data updates and processing, ideal for real-time applications.

Memory Density: 65536 bit

High memory density allows for ample data storage capacity, suitable for complex applications and data processing tasks.

Memory IC Type: EEPROM

EEPROM memory IC type offers non-volatile memory storage, retaining data even when power is disconnected.

Technical Specifications

EEPROM CAT24S64C4ATR attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Additional Features:

LG-MAX, WD-MAX, ALSO AVAILABLE 1.6-5.5V OPERATES WITH 0.1MHZ AND 0.4MHZ

Maximum Clock Frequency (fCLK):

1 MHz

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

Length:

.85 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.35 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.85 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

CAT24S64C4ATR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20