Loading...

BMS3004-1E

Onsemi

BMS3004-1E by Onsemi

BMS3004-1E by Onsemi is a P-channel Power FET with 75V DS breakdown voltage, 272A IDM, and 0.0114 ohm max RDS(on). Ideal for applications requiring high drain current handling capabilities in enhancement mode operation. Package style: Flange mount, terminal finish: Matte Tin, and isolated case connection.

Median Price

$3.310

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,108 parts In-Stock

1+ parts

$3.310

100+ parts

$3.110

1k+ parts

$2.810

10k+ parts

-

2,108

$3.310

$3.110

$2.810

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 801 parts In-Stock

1+ parts

$3.144

100+ parts

-

1k+ parts

-

10k+ parts

-

801

$3.144

-

-

-

Chip Stock

USA . 5,156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,156

-

-

-

-

Vyrian

USA . 4,102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,102

-

-

-

-

Greenchips

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

SIE Connect GmbH - GreenChips

Germany . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 211 parts In-Stock

1+ parts

$1.138

100+ parts

-

1k+ parts

-

10k+ parts

-

211

$1.138

-

-

-

Northwest PG Solutions

USA . 1,912 parts In-Stock

1+ parts

$1.252

100+ parts

-

1k+ parts

-

10k+ parts

-

1,912

$1.252

-

-

-

Corphita

USA . 508 parts In-Stock

1+ parts

$2.979

100+ parts

-

1k+ parts

-

10k+ parts

-

508

$2.979

-

-

-

Continental Prestige Electronics

USA . 335 parts In-Stock

1+ parts

$3.010

100+ parts

$2.220

1k+ parts

-

10k+ parts

-

335

$3.010

$2.220

-

-

Corohmni

South Africa . 311 parts In-Stock

1+ parts

$3.310

100+ parts

-

1k+ parts

-

10k+ parts

-

311

$3.310

-

-

-

AZTECH Wire

Italy . 670 parts In-Stock

1+ parts

$13.570

100+ parts

-

1k+ parts

-

10k+ parts

-

670

$13.570

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,220

-

-

-

-

Perfect Parts

USA . 20,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,500

-

-

-

-

Kepictronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

TANS Electronics

Latvia . 5,632 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,632

-

-

-

-

Problanco Electronics

Mexico . 3,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,470

-

-

-

-

Kulean Microsystems

USA . 1,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,914

-

-

-

-

SupplyDigital Components

Austria . 1,862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,862

-

-

-

-

UHIMA Technologies

Türkiye . 915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

915

-

-

-

-

Overview

Enhance your power management solutions with the BMS3004-1E by Onsemi. Designed with top-quality materials and advanced technology, this P-channel power FET offers unparalleled performance and reliability. From its single configuration with a built-in diode to its high breakdown voltage of 75V, this transistor is perfect for a wide range of applications. Whether you're looking to optimize your automotive systems or increase efficiency in industrial equipment, the BMS3004-1E delivers exceptional value and benefits to customers seeking superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability of the FET in various operating conditions.

Polarity or Channel Type: P-CHANNEL

The P-channel type configuration offers lower power consumption and better efficiency in certain applications compared to N-channel types.

Minimum DS Breakdown Voltage: 75 V

With a minimum breakdown voltage of 75 V, this FET can handle high voltages without breakdown, ensuring safe and reliable operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various circuit designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit from voltage spikes and reverse currents, enhancing the overall performance and reliability of the FET.

Maximum Pulsed Drain Current (IDM): 272 A

With a high maximum pulsed drain current rating, this FET is suitable for applications requiring high power handling capabilities.

Avalanche Energy Rating (EAS): 380 mJ

The high avalanche energy rating of 380 mJ ensures that the FET can withstand transient voltage spikes without damage, increasing its reliability in harsh environments.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides mechanical stability and ease of mounting, ideal for industrial applications.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its high performance and reliability, making it a suitable choice for power FETs.

Maximum Drain-Source On Resistance: 0.0114 ohm

The low on-resistance of 0.0114 ohm ensures minimal power loss and efficient power handling in the FET, making it suitable for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) BMS3004-1E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

380 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (ID):

68 A

Maximum Drain-Source On Resistance:

.0114 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

272 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

BMS3004-1E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 3