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ADM1030ARQZ-RL7

Onsemi

ADM1030ARQZ-RL7 by Onsemi

ADM1030ARQZ-RL7 by Onsemi is an 8-bit temperature sensor with a supply voltage range of 3V to 5.5V. It operates b/w 0 °C to 100°C, featuring a 2-wire interface for digital output. Ideal for applications requiring precise temperature monitoring in compact spaces with surface mounting feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,898 parts In-Stock

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Digiode

USA . 545 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$4.323

100+ parts

$4.279

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$4.106

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$4.323

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AZTECH Wire

Italy . 1,147 parts In-Stock

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$18.220

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Native Components

USA . 515 parts In-Stock

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$162.457

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$155.959

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Northwest PG Solutions

USA . 1,025 parts In-Stock

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$178.703

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QUARKTWIN TECHNOLOGY LTD

USA . 19,005 parts In-Stock

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Problanco Electronics

Mexico . 7,967 parts In-Stock

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SupplyDigital Components

Austria . 5,758 parts In-Stock

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TANS Electronics

Latvia . 4,575 parts In-Stock

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Microchip USA

USA . 4,005 parts In-Stock

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UHIMA Technologies

Türkiye . 759 parts In-Stock

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Corohmni

South Africa . 381 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 198 parts In-Stock

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Overview

Discover the Onsemi ADM1030ARQZ-RL7, a top-of-the-line temperature sensor that offers unparalleled accuracy and reliability. Manufactured by industry leader Onsemi, this sensor is perfect for a wide range of applications, from automotive to industrial settings. With its advanced technology and high-quality construction, customers can trust in the precision and performance of this sensor. Say goodbye to guesswork and hello to peace of mind with the ADM1030ARQZ-RL7, your solution for temperature monitoring needs.

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

Allows for a wide range of power input, making it versatile for different electronic systems.

No. of Bits: 8

Provides accurate temperature readings with higher resolution due to the 8-bit precision.

Body Width: 3.91 inch

Compact size makes it suitable for applications where space is limited.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Offers multiple output options for flexibility in connecting to different systems.

Body Height: 1.44 mm

Low profile design allows for easy integration in various devices.

Package Shape or Style: RECTANGULAR

Standard shape for ease of mounting and compatibility with existing designs.

Minimum Supply Voltage: 3 V

Works efficiently even with lower power input, saving energy and extending battery life.

Maximum Operating Temperature: 100 °C

Suitable for high-temperature environments, ensuring reliable performance in varying conditions.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature settings without compromising accuracy.

Terminal Finish: Tin (Sn)

Provides corrosion resistance and good electrical conductivity for durable performance.

Body Length/Diameter: 4.9 mm

Compact size for easy installation and efficient space utilization.

Termination Type: SOLDER

Secure connection method for reliable data transmission and consistent performance.

Output Interface Type: 2-WIRE INTERFACE

Simplified wiring setup for quick and easy integration with other electronic components.

Mounting Feature: SURFACE MOUNT

Allows for convenient placement on circuit boards, saving space and facilitating assembly.

Technical Specifications

Temperature Sensors ADM1030ARQZ-RL7 attributes and parameters. Explore more Temperature Sensors devices from Onsemi

Specs

Maximum Accuracy (Cel):

1

Body Width:

3.91 inch

Body Height:

1.44 mm

Body Length/Diameter:

4.9 mm

JESD-609 Code:

e3

Mounting Feature:

No. of Bits:

8

Maximum Operating Current:

3 mA

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Terminal Finish:

Tin (Sn)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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