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ADM1031ARQZ

Onsemi

ADM1031ARQZ by Onsemi

TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: HYSTERESIS IS 0.5V; Body Width: 3.9 inch; Maximum Operating Current: 3 mA;

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,328 parts In-Stock

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3,328

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Chip Stock

USA . 3,158 parts In-Stock

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3,158

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Touchstone Systems

USA . 1,925 parts In-Stock

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1,925

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Bristol Electronics

USA . 1,665 parts In-Stock

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1,665

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Digiode

USA . 836 parts In-Stock

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836

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Flip Electronics

USA . 160 parts In-Stock

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160

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Distributors (Availability)

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Northwest PG Solutions

USA . 2,879 parts In-Stock

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$1.232

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2,879

$1.232

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Parana Technologies

USA . 914 parts In-Stock

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$2.707

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$2.518

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914

$2.707

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$2.518

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IDEA Electronic Components Group

UK . 378 parts In-Stock

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$2.911

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$2.765

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378

$2.911

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$2.765

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DigiPath Technology Company

USA . 2,274 parts In-Stock

1+ parts

$4.541

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$4.360

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$4.541

$4.360

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AZTECH Wire

Italy . 256 parts In-Stock

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$5.982

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$5.982

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One Stop Electronics

USA . 1,482 parts In-Stock

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$16.750

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Component Stockers USA

USA . 426 parts In-Stock

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$99.990

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Vigor

Singapore . 9,000 parts In-Stock

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Kulean Microsystems

USA . 6,410 parts In-Stock

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SupplyDigital Components

Austria . 6,050 parts In-Stock

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Problanco Electronics

Mexico . 5,232 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,845 parts In-Stock

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ChipTracer

USA . 1,665 parts In-Stock

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Corphita

USA . 1,005 parts In-Stock

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Perfect Parts

USA . 986 parts In-Stock

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TANS Electronics

Latvia . 975 parts In-Stock

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Kepictronics

USA . 549 parts In-Stock

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549

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Native Components

USA . 366 parts In-Stock

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$2.380

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366

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Corohmni

South Africa . 258 parts In-Stock

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Microchip USA

USA . 196 parts In-Stock

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UHIMA Technologies

Türkiye . 182 parts In-Stock

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GreenTree Electronics

Israel . 156 parts In-Stock

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Technical Specifications

Temperature Sensors ADM1031ARQZ attributes and parameters. Explore more Temperature Sensors devices from Onsemi

Specs

Maximum Accuracy (Cel):

3

Additional Features:

HYSTERESIS IS 0.5V

Body Width:

3.9 inch

Body Height:

1.64 mm

Body Length/Diameter:

4.89 mm

JESD-609 Code:

e3

Mounting Feature:

No. of Bits:

11

Maximum Operating Current:

3 mA

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Terminal Finish:

Tin (Sn)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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