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74HC245DTR2G

Onsemi

74HC245DTR2G by Onsemi

74HC245DTR2G by Onsemi is a bus driver & transceiver with 8 bits and a propagation delay of 22 ns. It operates at a nominal voltage of 3V and has a max operating temperature of 125°C. This component is commonly used in bidirectional control applications requiring fast data transmission.

Median Price

$0.185

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 216,533 parts In-Stock

1+ parts

-

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$0.211

216,533

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$0.211

Rochester

USA . 216,513 parts In-Stock

1+ parts

-

100+ parts

$0.185

1k+ parts

$0.153

10k+ parts

$0.137

216,513

-

$0.185

$0.153

$0.137

Verical

USA . 204,187 parts In-Stock

1+ parts

-

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$0.171

204,187

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$0.171

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.135

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-

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50

$0.135

-

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Digiode

USA . 1,078 parts In-Stock

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$0.144

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1,078

$0.144

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Greenchips

USA . 527 parts In-Stock

1+ parts

$0.151

100+ parts

$0.142

1k+ parts

$0.128

10k+ parts

$0.128

527

$0.151

$0.142

$0.128

$0.128

VNN

France . 3,461 parts In-Stock

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3,461

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Vyrian

USA . 2,285 parts In-Stock

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2,285

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Magnum Semiconductors LLP

India . 1,168 parts In-Stock

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1,168

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SIE Connect GmbH - GreenChips

Germany . 527 parts In-Stock

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527

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Bristol Electronics

USA . 395 parts In-Stock

1+ parts

-

100+ parts

$0.375

1k+ parts

$0.225

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395

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$0.375

$0.225

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Microfarads

USA . 373 parts In-Stock

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373

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Distributors (Availability)

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Ampacity Inc.

Singapore . 212,328 parts In-Stock

1+ parts

$0.129

100+ parts

-

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212,328

$0.129

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Argo Parts USA

USA . 2,525 parts In-Stock

1+ parts

$0.135

100+ parts

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1k+ parts

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$0.131

2,525

$0.135

-

-

$0.131

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.135

100+ parts

-

1k+ parts

$0.128

10k+ parts

$0.126

100

$0.135

-

$0.128

$0.126

Corphita

USA . 770 parts In-Stock

1+ parts

$0.137

100+ parts

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770

$0.137

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Component Stockers USA

USA . 295,210 parts In-Stock

1+ parts

$0.150

100+ parts

$0.140

1k+ parts

$0.130

10k+ parts

$0.130

295,210

$0.150

$0.140

$0.130

$0.130

Corohmni

South Africa . 372 parts In-Stock

1+ parts

$0.151

100+ parts

-

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372

$0.151

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AZTECH Wire

Italy . 122 parts In-Stock

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$9.210

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122

$9.210

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Continental Prestige Electronics

USA . 216,533 parts In-Stock

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$0.131

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216,533

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$0.131

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Problanco Electronics

Mexico . 7,845 parts In-Stock

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7,845

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Perfect Parts

USA . 7,024 parts In-Stock

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7,024

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SupplyDigital Components

Austria . 5,387 parts In-Stock

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TANS Electronics

Latvia . 5,074 parts In-Stock

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5,074

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kulean Microsystems

USA . 2,931 parts In-Stock

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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Kepictronics

USA . 1,809 parts In-Stock

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1,809

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Futuretech Components

Singapore . 885 parts In-Stock

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885

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UHIMA Technologies

Türkiye . 774 parts In-Stock

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774

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GreenTree Electronics

Israel . 734 parts In-Stock

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734

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Microchip USA

USA . 298 parts In-Stock

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298

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Overview

Experience the superior quality and reliability of Onsemi with the 74HC245DTR2G. As a leading manufacturer in the industry, Onsemi ensures that this bus driver and transceiver delivers exceptional performance for a wide range of applications. With its compact design and advanced technology, this product offers customers unmatched value and benefits. From its fast propagation delay to its high operating temperature, the 74HC245DTR2G is designed to exceed expectations. Trust Onsemi for all your bus driver and transceiver needs and experience the advantage of top-quality products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and resistance to various external factors, making this product a reliable choice.

Propagation Delay At Nominal Supply: 22 ns

With a low propagation delay, this product allows for fast and efficient signal transmission, enhancing overall performance.

Surface Mount: YES

The surface mount capability provides ease of installation and compatibility with modern applications, making it a convenient option.

No. of Functions: 1

The single function design simplifies integration and operation, providing a straightforward solution for bus driver and transceiver applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and placement, making it suitable for various installation requirements.

No. of Bits: 8

With 8 bits, this product offers a wide range of data processing capabilities, perfect for applications that require handling multiple data signals simultaneously.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V, this product offers optimized power efficiency without compromising performance.

Power Supplies (V): 2/6

Supporting a range of power supplies from 2V to 6V, this product provides flexibility in various power configurations, making it adaptable to different system requirements.

No. of Terminals: 20

The 20 terminals allow for seamless connection and integration with other components, enabling smooth operation and communication within the system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style ensure compactness and space-saving design, ideal for applications with limited physical space.

Maximum I (ol): 6 Amp

With a maximum output current of 6 Amps, this product provides robust current-handling capabilities, suitable for driving high-power loads.

Propagation Delay (tpd): 110 ns

The propagation delay of 110 ns ensures efficient signal transmission and minimal signal distortion, contributing to reliable data transfer.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C, this product exhibits excellent thermal performance, enabling it to withstand harsh environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics enable tri-state logic control, allowing for efficient bus sharing and minimizing signal interference.

Minimum Operating Temperature: -55 °C

Operating at a minimum temperature of -55°C, this product is designed to withstand extreme cold conditions, ensuring reliable performance even in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity, corrosion resistance, and long-term reliability, making this product a durable choice.

Terminal Position: DUAL

With dual terminal positions, this product offers flexibility in PCB layout and connection options, facilitating easy integration into various system designs.

No. of Ports: 2

The 2 ports enable simultaneous connectivity and communication with multiple devices, increasing versatility and usability in various bus driver and transceiver applications.

Maximum Seated Height: 1.2 mm

With a low maximum seated height of 1.2 mm, this product offers space-efficient design possibilities, making it suitable for compact and slim form factor applications.

Width: 4.4 mm

The width of 4.4 mm ensures compactness and compatibility with narrow layouts, providing ease of integration in space-constrained environments.

Output Polarity: TRUE

The true output polarity ensures accurate and reliable signal transmission, avoiding errors and facilitating proper data interpretation.

Minimum Supply Voltage (Vsup): 2 V

With a minimum supply voltage of 2V, this product allows for low-power operation while maintaining functionality, making it energy-efficient.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures secure solder joints during the manufacturing process, ensuring product reliability and durability.

Length: 6.5 mm

The length of 6.5 mm provides a compact form factor, facilitating integration in various system designs with limited space availability.

Temperature Grade: MILITARY

Designed to meet military-grade temperature requirements, this product is capable of operating in extreme temperature conditions, making it suitable for demanding applications.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and wide operating voltage range, meeting the demands of modern bus driver and transceiver applications.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable solder connections, minimizing the risk of disconnection or failure during operation.

Packing Method: TR

The TR packing method offers convenience and protection during shipment and storage, assuring product integrity until it reaches its destination.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this product allows for fine-pitch connections, facilitating high-density PCB designs and efficient signal routing.

Count Direction: BIDIRECTIONAL

The bidirectional count direction enables seamless data transmission in both directions, providing flexibility in various bus communication scenarios.

Control Type: COMMON CONTROL

With a common control type, this product simplifies system architecture and reduces complexity, making it easier to integrate and operate.

Moisture Sensitivity Level (MSL): 1

Rated with a moisture sensitivity level of 1, this product is suitable for applications with low moisture content, ensuring long-term reliability and performance.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this product accommodates higher voltage systems, offering compatibility with a wide range of power supplies.

Technical Specifications

Bus Driver & Transceivers 74HC245DTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

4.4 mm

Trade Compliance

74HC245DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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