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2SK233G

Onsemi

2SK233G by Onsemi

2SK233G by Onsemi is a N-CHANNEL FET with 80V DS Breakdown Voltage. Ideal for AMPLIFIER applications, it has a Max Power Dissipation of 0.4W and operates in DEPLETION MODE. With a Package Style of CYLINDRICAL, it features SILICON Element Material and 2.5pF Feedback Capacitance (Crss).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,488 parts In-Stock

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Digiode

USA . 1,051 parts In-Stock

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1,051

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Native Components

USA . 272 parts In-Stock

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$0.726

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272

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Northwest PG Solutions

USA . 2,222 parts In-Stock

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$0.798

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SupplyDigital Components

Austria . 5,421 parts In-Stock

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TANS Electronics

Latvia . 3,539 parts In-Stock

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Kulean Microsystems

USA . 2,914 parts In-Stock

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Problanco Electronics

Mexico . 1,367 parts In-Stock

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UHIMA Technologies

Türkiye . 852 parts In-Stock

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Corphita

USA . 547 parts In-Stock

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Corohmni

South Africa . 394 parts In-Stock

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Overview

Enhance your amplifier projects with the reliable 2SK233G Small Signal Field Effect Transistor from Onsemi. Designed for high-performance applications, this N-CHANNEL FET offers a breakthrough in amplification technology. With a minimum DS Breakdown Voltage of 80V and maximum power dissipation of 0.4W, this transistor is perfect for your audio and signal processing needs. Trust Onsemi's expertise in semiconductor manufacturing to deliver quality components that ensure optimal performance. Take your projects to the next level with the 2SK233G and experience superior amplification like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the transistor, ensuring a longer lifespan and reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high input impedance and fast switching speeds, making them suitable for amplifier applications where low noise and high performance are crucial.

Minimum DS Breakdown Voltage: 80 V

With a minimum breakdown voltage of 80 V, this transistor can handle higher voltages without failing, making it suitable for various amplifier applications where high voltage is required.

Package Shape: ROUND

The round package shape allows for easy installation and PCB mounting, making it convenient to integrate into amplifier circuits and other electronic devices.

Operating Mode: DEPLETION MODE

Depletion mode transistors have a normally-on state, which can be advantageous in certain amplifier applications where a constant signal is required without the need for additional biasing.

Maximum Power Dissipation (Abs): 0.4 W

With a maximum power dissipation of 0.4 W, this transistor can handle moderate power levels without overheating, ensuring reliable operation in amplifier circuits.

Maximum Operating Temperature: 125 °C

The maximum operating temperature of 125 °C allows for high-temperature operation without degradation in performance, making it suitable for use in a wide range of environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) 2SK233G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

80 V

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

2.5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.4 W

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

2SK233G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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