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0W633-001-XTP

Onsemi

0W633-001-XTP by Onsemi

The Onsemi 0W633-001-XTP is a DSP with max. clock freq. of 50 MHz, low power mode, and barrel shifter. Ideal for industrial applications, it operates b/w -40 to 85 °C with a supply voltage range of 0.9V to 2V. Featuring a grid array package style, it has 49 terminals in a square shape measuring 5x5 mm.

Median Price

$18.365

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,735 parts In-Stock

1+ parts

$20.120

100+ parts

$18.920

1k+ parts

$17.110

10k+ parts

-

5,735

$20.120

$18.920

$17.110

-

Farnell

UK . 5,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$16.610

5,735

-

-

-

$16.610

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,154 parts In-Stock

1+ parts

$19.114

100+ parts

-

1k+ parts

-

10k+ parts

-

2,154

$19.114

-

-

-

Vyrian

USA . 7,683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,683

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 135 parts In-Stock

1+ parts

$16.610

100+ parts

-

1k+ parts

-

10k+ parts

-

135

$16.610

-

-

-

Corphita

USA . 1,002 parts In-Stock

1+ parts

$18.108

100+ parts

-

1k+ parts

-

10k+ parts

-

1,002

$18.108

-

-

-

AZTECH Wire

Italy . 1,054 parts In-Stock

1+ parts

$19.400

100+ parts

-

1k+ parts

-

10k+ parts

-

1,054

$19.400

-

-

-

Native Components

USA . 709 parts In-Stock

1+ parts

$40.277

100+ parts

-

1k+ parts

-

10k+ parts

$38.666

709

$40.277

-

-

$38.666

Northwest PG Solutions

USA . 1,059 parts In-Stock

1+ parts

$44.304

100+ parts

-

1k+ parts

-

10k+ parts

-

1,059

$44.304

-

-

-

TANS Electronics

Latvia . 7,935 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,935

-

-

-

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Continental Prestige Electronics

USA . 5,748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$25.370

10k+ parts

-

5,748

-

-

$25.370

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Kulean Microsystems

USA . 4,218 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,218

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-

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SupplyDigital Components

Austria . 2,468 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,468

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-

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Problanco Electronics

Mexico . 1,463 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,463

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-

-

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UHIMA Technologies

Türkiye . 689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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689

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-

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Microchip USA

USA . 397 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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397

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Overview

Unleash the power of cutting-edge technology with the 0W633-001-XTP by Onsemi. As a leader in digital signal processors, Onsemi delivers top-notch quality and reliability in every product. This versatile DSP is perfect for a wide range of applications, offering high performance and efficiency. With a compact package design and low power mode, this product provides unmatched value and benefits to customers looking to optimize their systems. Stay ahead of the curve with the 0W633-001-XTP and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various environments.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 2 V

Supports a higher voltage input, allowing for flexibility in power supply options.

Package Shape: SQUARE

Simplifies the design and layout of the circuit board, optimizing space utilization.

No. of Terminals: 49

Provides a sufficient number of connections for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Facilitates high-density packaging, enabling compact and efficient system integration.

Minimum Supply Voltage: 0.9 V

Supports low power operation, reducing energy consumption and heat generation.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, enhancing product longevity.

Minimum Operating Temperature: -40 °C

Supports operation in extreme cold conditions, making the product versatile and resilient.

Terminal Position: BOTTOM

Facilitates easy access for soldering and connectivity, simplifying the assembly process.

Maximum Seated Height: 1.1 mm

Allows for slim and compact designs, ideal for space-constrained applications.

Width: 5 mm

Compact size enables versatile placement on circuit boards, optimizing layout and design options.

Maximum Clock Frequency: 50 MHz

Supports high-speed processing and data throughput, enhancing performance capabilities.

Internal Bus Architecture: MULTIPLE

Enables efficient data transfer and communication between components, improving overall system efficiency.

Length: 5 mm

Compact size allows for flexible placement and integration into various system designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where ruggedness and reliability are essential.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Versatile functionality supports various signal processing tasks, making the product suitable for diverse applications.

Technology: CMOS

Offers low power consumption and high noise immunity, enhancing overall performance efficiency.

Terminal Form: BALL

Facilitates reliable and secure connections, ensuring stability during operation.

Nominal Supply Voltage: 1.8 V

Optimal operating voltage for balanced performance and power efficiency.

Terminal Pitch: 0.5 mm

Allows for fine pitch connections, enabling high-density integration and space-saving designs.

Format: FIXED POINT

Enables precise and efficient numerical calculations, essential for signal processing tasks.

Low Power Mode: YES

Supports energy-saving operation modes, extending battery life and reducing overall power consumption.

Barrel Shifter: YES

Enhances data manipulation and processing capabilities, improving overall efficiency and performance.

Technical Specifications

Digital Signal Processors (DSPs) 0W633-001-XTP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT NOMINAL 1.25V

Address Bus Width:

0

Barrel Shifter:

YES

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B49

Length:

5 mm

Low Power Mode:

YES

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Trade Compliance

0W633-001-XTP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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