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PCA9554ABS3

NXP Semiconductors

PCA9554ABS3 by NXP Semiconductors

PCA9554ABS3 from NXP Semiconductors is an 8-bit parallel I/O port with a supply voltage range of 2.3V to 5.5V, ideal for industrial applications. It features a compact square package (3mm x 3mm) and operates in temperatures from -40 °C to 85 °C. This CMOS device supports surface mount technology, making it suitable for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,822 parts In-Stock

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Digiode

USA . 3,392 parts In-Stock

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3,392

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Anansix

USA . 1,736 parts In-Stock

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One Stop Electronics

USA . 1,646 parts In-Stock

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$13.000

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Corohmni

South Africa . 474 parts In-Stock

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$25.234

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474

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UNI Independent Distributors

Spain . 4,630 parts In-Stock

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4,630

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,672 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,532 parts In-Stock

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Kepictronics

USA . 212 parts In-Stock

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Overview

Unlock endless possibilities with the PCA9554ABS3 from NXP Semiconductors, a leader in high-quality semiconductor solutions. This versatile parallel I/O port is designed for optimal performance across various applications, ensuring seamless integration into your projects. With its compact design and robust temperature range, it delivers reliability and efficiency, allowing you to enhance your designs while minimizing space. Experience the superior quality and innovation that NXP brings to the table!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction offers durability and environmental resistance, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability allows for a more compact design, making it suitable for high-density applications.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V enables flexibility in various power supply configurations.

Package Shape: SQUARE

The square package shape optimizes space usage on printed circuit boards, enhancing design efficiency.

No. of Bits: 8

With 8 bits, this device supports versatile data transmission, making it ideal for a range of applications.

Power Supplies (V): 2.5/5

The dual supply voltage options (2.5 V and 5 V) facilitate compatibility with multiple systems.

No. of Terminals: 16

Having 16 terminals allows for a robust connection and enhanced versatility in I/O operations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style aids in efficient thermal management and saves space within compact devices.

Minimum Supply Voltage: 2.3 V

A minimum supply voltage of 2.3 V ensures stable operation even in low-power applications.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature makes the product suitable for industrial-grade environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures reliability in extreme conditions, expanding its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finishing enhances conductivity and reduces corrosion, boosting longevity.

Terminal Position: QUAD

Quad terminal positioning allows for efficient layout and routing on the PCB, facilitating signal integrity.

Maximum Seated Height: 1 mm

A low seated height of 1 mm is advantageous for ultra-thin designs, meeting modern aesthetic standards.

Width: 3 mm

A compact width promotes efficient space utilization within electronic designs.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures reliability during soldering processes without damaging the component.

Peak Reflow Temperature: 260

A high reflow temperature accommodates various soldering techniques, providing design flexibility.

Length: 3 mm

At only 3 mm in length, this component is designed for efficient use of limited space in applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robust performance in harsh conditions, ensuring product reliability.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it serves a myriad of applications, enhancing versatility.

Technology: CMOS

CMOS technology contributes to low power consumption and high noise immunity, making it efficient.

Terminal Form: NO LEAD

No-lead terminals simplify PCB assembly and improve electrical performance by reducing parasitic effects.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V aligns with standard low-power applications, boosting efficiency.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for dense circuit layouts, accommodating space-constrained designs.

No. of I/O Lines: 8

With 8 I/O lines, this product supports multiple concurrent data flows, useful in complex applications.

Technical Specifications

Parallel I/O Ports PCA9554ABS3 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Peripheral IC Type:

Trade Compliance

PCA9554ABS3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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