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TJA1083TTJ

NXP Semiconductors

TJA1083TTJ by NXP Semiconductors

TJA1083TTJ by NXP Semiconductors is a robust FlexRay transceiver designed for automotive applications, operating at 5V with a max current of 60mA. It features a temperature range from -40 °C to 125 °C and supports data rates up to 10 Mbps. Its compact SOIC package ensures efficient surface mounting in space-constrained environments.

Median Price

$3.682

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 618 parts In-Stock

1+ parts

$4.730

100+ parts

$3.270

1k+ parts

$2.860

10k+ parts

$2.630

618

$4.730

$3.270

$2.860

$2.630

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$2.635

10,000

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-

$2.635

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,760 parts In-Stock

1+ parts

$3.420

100+ parts

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1,760

$3.420

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Bristol Electronics

USA . 2,910 parts In-Stock

1+ parts

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2,910

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Vyrian

USA . 2,881 parts In-Stock

1+ parts

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2,881

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Flip Electronics

USA . 2,465 parts In-Stock

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2,465

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Anansix

USA . 930 parts In-Stock

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930

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 489 parts In-Stock

1+ parts

$3.240

100+ parts

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489

$3.240

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Microchip USA

USA . 5,138 parts In-Stock

1+ parts

$16.427

100+ parts

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5,138

$16.427

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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UNI Independent Distributors

Spain . 1,324 parts In-Stock

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1,324

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Overview

Unlock seamless connectivity and superior performance with the TJA1083TTJ from NXP Semiconductors, a trusted leader in innovative network interfaces. Engineered for automotive excellence, this robust FlexRay transceiver thrives in extreme conditions, ensuring reliable communication in critical applications. With its compact design and AEC-Q100 certification, customers can count on the TJA1083TTJ to deliver exceptional value, efficiency, and peace of mind in their next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body provides excellent durability and protection against environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Being a surface mount device allows for efficient space utilization on circuit boards, enabling higher density designs common in modern electronics.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures the product meets rigorous automotive reliability and quality requirements, making it dependable for critical applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes PCB layout flexibility, allowing for easier integration into various designs.

Power Supplies (V): 5

Operates at a standard 5V supply, making it compatible with a wide range of existing systems and simplifying design considerations.

No. of Terminals: 14

The 14 terminals support extensive connectivity options for various applications, enhancing the versatility of the device.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile reduce the overall footprint, which is crucial for size-sensitive applications typically found in automotive and telecom sectors.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in high-heat environments, critical for automotive applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the product is suited for extreme conditions, ensuring performance in harsh climates.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The premium terminal finish enhances corrosion resistance and improves long-term electrical performance, essential for reliability.

Terminal Position: DUAL

Dual terminal positions enhance the device's mounting flexibility, allowing for better integration into various PCB designs.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds helps maintain component integrity during soldering processes, crucial for production quality.

Peak Reflow Temperature (°C): 260

The high peak reflow temperature ensures compatibility with modern soldering techniques and materials, vital for effective manufacturing.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, the temperature grade assures enhanced reliability in rigorous automotive environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and improves mechanical stability, making assembly and reliability straightforward.

Maximum Supply Current: 60 mA

The device's maximum supply current of 60 mA indicates efficient power consumption, which is crucial for energy-sensitive applications.

Telecom IC Type: FLEXRAY TRANSCEIVER

As a FlexRay transceiver, the IC is ideal for high-speed automotive communication, ensuring robust data transmission in large networks.

Nominal Supply Voltage: 5 V

Nominal 5V supply voltage simplifies power management within systems, making it easier to design around existing infrastructure.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch allows for compact designs while still facilitating reliable soldering and connections.

Data Rate: 10 Mbps

With a data rate of 10 Mbps, the device supports high-speed data transfer essential for efficient automotive networking applications.

Technical Specifications

Network Interfaces TJA1083TTJ attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

10 Mbps

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

14

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Network Interfaces

Maximum Supply Current:

60 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TJA1083TTJ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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