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TJA1054AT/VM,512

NXP Semiconductors

TJA1054AT/VM,512 by NXP Semiconductors

NXP Semiconductors' TJA1054AT/VM,512 is a CAN transceiver with 14 terminals and operates at 5V. It features a small outline package style, matte tin terminal finish, and AEC-Q100 screening level. Ideal for automotive applications due to its low supply current of 0.027 mA and compatibility with surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,858 parts In-Stock

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Digiode

USA . 4,690 parts In-Stock

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Anansix

USA . 2,675 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Microchip USA

USA . 406 parts In-Stock

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$7.863

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Aztec Data Supply Inc.

USA . 900 parts In-Stock

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$8.520

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Corohmni

South Africa . 188 parts In-Stock

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AZTECH Wire

Italy . 339 parts In-Stock

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Semicontronic

India . 1,115 parts In-Stock

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$242.000

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$235.950

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$234.740

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Ampacity Inc.

Singapore . 1,498 parts In-Stock

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One Stop Electronics

USA . 1,499 parts In-Stock

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Continental Prestige Electronics

USA . 6,579 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

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Corphita

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UNI Independent Distributors

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Bastille Electronics

Australia . 450 parts In-Stock

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Perfect Parts

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Assy Fe

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Overview

Looking for a reliable network interface solution? Look no further than the TJA1054AT/VM,512 by NXP Semiconductors. With a reputation for producing high-quality components, NXP Semiconductors delivers exceptional performance and reliability in their CAN transceivers. Perfect for a wide range of applications, this product offers customers unmatched value and benefits. Upgrade your network interface with the TJA1054AT/VM,512 and experience the advantages of NXP Semiconductors' top-notch technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to wear and tear, making this product long-lasting.

Surface Mount: YES

Surface mount installation allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this product suitable for automotive applications where reliability is crucial.

Power Supplies (V): 5

Operating at 5V ensures compatibility with a wide range of systems and devices, making this product versatile and widely usable.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards, making this product ideal for applications with limited space constraints.

Terminal Finish: MATTE TIN

Matte Tin terminal finish provides good conductivity and corrosion resistance, ensuring stable and reliable connections.

Telecom IC Type: CAN TRANSCEIVER

CAN transceiver type is widely used in automotive and industrial applications, making this product suitable for communication in these sectors.

Technical Specifications

Network Interfaces TJA1054AT/VM,512 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.027 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1054AT/VM,512 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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