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TJA1054AT/S900VM,5

NXP Semiconductors

TJA1054AT/S900VM,5 by NXP Semiconductors

NXP Semiconductors' TJA1054AT/S900VM,5 is a CAN transceiver with 14 terminals and 5V nominal voltage. It features AEC-Q100 screening level, matte tin terminal finish, and gull wing terminal form. Ideal for automotive applications due to its small outline package style and low supply current of 0.027 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,952 parts In-Stock

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8,952

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Digiode

USA . 4,659 parts In-Stock

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4,659

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Anansix

USA . 1,170 parts In-Stock

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1,170

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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Microchip USA

USA . 560 parts In-Stock

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$7.089

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560

$7.089

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Corohmni

South Africa . 534 parts In-Stock

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$9.880

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534

$9.880

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Aztec Data Supply Inc.

USA . 209 parts In-Stock

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$10.470

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209

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AZTECH Wire

Italy . 534 parts In-Stock

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$17.787

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534

$17.787

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Component Stockers USA

USA . 601 parts In-Stock

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$99.990

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601

$99.990

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Semicontronic

India . 259 parts In-Stock

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$199.000

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$194.025

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$193.030

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259

$199.000

$194.025

$193.030

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One Stop Electronics

USA . 1,591 parts In-Stock

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$530.000

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$530.000

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Ampacity Inc.

Singapore . 237 parts In-Stock

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$835.000

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237

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Vigor

Singapore . 9,226 parts In-Stock

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UNI Independent Distributors

Spain . 4,100 parts In-Stock

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Continental Prestige Electronics

USA . 2,004 parts In-Stock

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Corphita

USA . 1,743 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Argo Parts USA

USA . 5 parts In-Stock

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Overview

Discover the power of seamless networking with the TJA1054AT/S900VM,5 by NXP Semiconductors. This cutting-edge CAN transceiver offers unparalleled reliability and performance in a compact, easy-to-install package. Ideal for a wide range of applications, from automotive to industrial, this innovative product delivers top-notch quality and efficiency. Trust NXP Semiconductors to provide you with the best in network interfaces - upgrade your systems today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on PCBs, saving space and making the product suitable for compact designs.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and quality standards, making the product suitable for automotive applications where durability is crucial.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good solderability and corrosion resistance, ensuring reliable electrical connections in various environments.

Telecom IC Type: CAN TRANSCEIVER

Being a CAN transceiver, the product enables communication between different nodes in a Controller Area Network (CAN) system, making it suitable for automotive and industrial applications.

Technical Specifications

Network Interfaces TJA1054AT/S900VM,5 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.027 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1054AT/S900VM,5 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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