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TJA1054AT/N,112

NXP Semiconductors

TJA1054AT/N,112 by NXP Semiconductors

NXP Semiconductors' TJA1054AT/N,112 is a 14-terminal interface circuit with 5V supply voltage. It features GULL WING terminals, PLASTIC/EPOXY body material, and small outline package style. Ideal for telecom applications requiring surface mount technology in a compact 8.65mm x 3.9mm rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,882 parts In-Stock

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Vyrian

USA . 2,158 parts In-Stock

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Anansix

USA . 750 parts In-Stock

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750

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Nova Conductors

Japan . 27 parts In-Stock

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27

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Distributors (Availability)

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Microchip USA

USA . 373 parts In-Stock

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$7.152

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373

$7.152

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Aztec Data Supply Inc.

USA . 64 parts In-Stock

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$8.558

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64

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Corohmni

South Africa . 100 parts In-Stock

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$10.324

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100

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AZTECH Wire

Italy . 564 parts In-Stock

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$15.138

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Ampacity Inc.

Singapore . 864 parts In-Stock

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$142.000

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One Stop Electronics

USA . 326 parts In-Stock

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$968.000

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326

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UNI Independent Distributors

Spain . 6,091 parts In-Stock

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Corphita

USA . 4,278 parts In-Stock

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Argo Parts USA

USA . 3,997 parts In-Stock

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Continental Prestige Electronics

USA . 261 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Discover unparalleled quality and reliability with the TJA1054AT/N,112 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors offers top-of-the-line network interfaces that are perfect for a wide range of applications. From automotive to industrial, this versatile product provides exceptional value, seamless connectivity, and enhanced performance. Trust NXP Semiconductors to deliver cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects with the TJA1054AT/N,112 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures a lightweight and durable design, making this product easy to handle and long-lasting.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation, making it convenient for users to integrate this network interface into their systems.

No. of Terminals: 14

Having 14 terminals provides ample connection points, allowing for versatile connectivity options and compatibility with various systems.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to power and integrate into existing setups.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm enables high-density mounting, saving space on circuit boards and making this network interface suitable for compact designs.

Technical Specifications

Network Interfaces TJA1054AT/N,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1054AT/N,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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