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TJA1048T,112

NXP Semiconductors

TJA1048T,112 by NXP Semiconductors

NXP Semiconductors' TJA1048T,112 is a network interface with 2 transceivers and 1 Mbps data rate. It operates at 5V nominal voltage and consumes 0.14 mA max supply current. This AEC-Q100 compliant chip is ideal for automotive interface circuit applications due to its small outline package and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,443 parts In-Stock

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Digiode

USA . 1,862 parts In-Stock

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Anansix

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Nova Conductors

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AZTECH Wire

Italy . 731 parts In-Stock

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$5.986

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Microchip USA

USA . 364 parts In-Stock

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Corohmni

South Africa . 624 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,664 parts In-Stock

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One Stop Electronics

USA . 402 parts In-Stock

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Semicontronic

India . 212 parts In-Stock

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$706.875

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Ampacity Inc.

Singapore . 1,646 parts In-Stock

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Corphita

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Argo Parts USA

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UNI Independent Distributors

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Robosynatics

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Lucentia Tech

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Unlock seamless communication and connectivity with the NXP Semiconductors TJA1048T,112. Crafted with precision and reliability in mind, this network interface chip promises unparalleled performance and efficiency for a wide range of applications. Whether you're looking to enhance automotive systems or streamline industrial processes, this cutting-edge technology offers unmatched value, benefits, and advantages to meet your unique needs. Trust NXP Semiconductors to deliver innovation that empowers your business to thrive in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for high-performance applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and facilitating production processes.

Screening Level: AEC-Q100

Meeting the AEC-Q100 screening level ensures that the product is suitable for automotive applications where reliability is crucial.

Power Supplies (V): 5

Operating at 5V makes it compatible with standard power sources and simplifies integration into existing systems.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options for various signal inputs and outputs, enhancing versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, allowing for more compact and efficient designs.

Terminal Finish: MATTE TIN

The matte tin finish offers good electrical conductivity and corrosion resistance, ensuring reliable signal transmission over time.

Maximum Seated Height: 1.75 mm

With a low maximum seated height, the product is suitable for applications where space constraints are a concern.

Width: 3.9 mm

The narrow width allows for tight spacing between components, enabling dense and high-performance circuit layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature minimizes the risk of overheating or damage during assembly processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the heat stress of soldering processes without degrading.

Length: 8.65 mm

The compact length of the product contributes to space-saving designs and efficient use of PCB real estate.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical attachment and facilitates automated soldering processes for reliability.

No. of Transceivers: 2

Having 2 transceivers allows for simultaneous bidirectional communication, enhancing connectivity options and data transfer capabilities.

Maximum Supply Current: 0.14 mA

The low maximum supply current consumption helps in reducing overall power usage and extending battery life in portable devices.

Telecom IC Type: INTERFACE CIRCUIT

Being classified as an interface circuit telecom IC type indicates its compatibility with telecom systems and protocols for seamless integration.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and ease of integration in various applications.

Terminal Pitch: 1.27 mm

The compact terminal pitch allows for high-density pin configurations, enabling efficient signal routing and minimizing signal interference.

Data Rate: 1 Mbps

With a data rate of 1Mbps, the product offers high-speed data transmission capabilities, suitable for demanding communication tasks.

Technical Specifications

Network Interfaces TJA1048T,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

2

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.14 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TJA1048T,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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