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TJA1040T/N,112

NXP Semiconductors

TJA1040T/N,112 by NXP Semiconductors

NXP Semiconductors' TJA1040T/N,112 is a small outline network interface with 8 terminals and tin lead finish. It operates at 5V nominal voltage, suitable for interface circuits in telecom applications. The rectangular package measures 3.9mm in width and 4.9mm in length, making it ideal for surface mount designs with a low seated height of 1.75mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,368 parts In-Stock

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8,368

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Anansix

USA . 1,436 parts In-Stock

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1,436

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Digiode

USA . 1,248 parts In-Stock

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1,248

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Microchip USA

USA . 484 parts In-Stock

1+ parts

$8.523

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484

$8.523

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AZTECH Wire

Italy . 506 parts In-Stock

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$10.775

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506

$10.775

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Aztec Data Supply Inc.

USA . 190 parts In-Stock

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$11.590

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190

$11.590

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Corohmni

South Africa . 1,139 parts In-Stock

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$16.312

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1,139

$16.312

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One Stop Electronics

USA . 1,570 parts In-Stock

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$17.000

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1,570

$17.000

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Semicontronic

India . 1,003 parts In-Stock

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$115.000

100+ parts

$112.125

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$111.550

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1,003

$115.000

$112.125

$111.550

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Ampacity Inc.

Singapore . 990 parts In-Stock

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$864.000

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990

$864.000

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UNI Independent Distributors

Spain . 7,216 parts In-Stock

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Continental Prestige Electronics

USA . 1,187 parts In-Stock

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Argo Parts USA

USA . 695 parts In-Stock

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695

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Advanced Electronics

New Zealand . 450 parts In-Stock

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450

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Corphita

USA . 375 parts In-Stock

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375

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Enhance your network interfaces with the high-quality TJA1040T/N,112 by NXP Semiconductors. Designed with precision and reliability in mind, this small outline package offers a seamless surface mount solution for your connectivity needs. With dual terminal positions and a nominal supply voltage of 5V, this interface circuit is perfect for a wide range of applications. Trust NXP Semiconductors to deliver top-notch products that provide value, efficiency, and performance. Upgrade your networking capabilities today with the TJA1040T/N,112.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ideal for use in various networking applications.

Surface Mount: YES

Being surface mountable, this product can be easily mounted on PCBs, saving space and providing a clean and professional look to the circuit design.

No. of Terminals: 8

With 8 terminals, this product offers multiple connection points, allowing for a more versatile and flexible integration into a network system.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures good solderability and reliability, making it easier to achieve a secure and stable connection during installation.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, this product is compatible with standard power sources commonly used in networking equipment, making it easy to integrate into existing setups.

Technical Specifications

Network Interfaces TJA1040T/N,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1040T/N,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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