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TJA1020T/N1,112

NXP Semiconductors

TJA1020T/N1,112 by NXP Semiconductors

NXP Semiconductors' TJA1020T/N1,112 is a network interface IC with 8 terminals in a small outline package. It operates at 12V nominal voltage and has nickel palladium gold terminal finish. The IC is commonly used in telecom applications for interface circuits due to its compact size and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 8,832 parts In-Stock

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Digiode

USA . 3,819 parts In-Stock

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Anansix

USA . 1,581 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Bristol Electronics

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First Choice Components Inc.

USA . 8 parts In-Stock

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AZTECH Wire

Italy . 579 parts In-Stock

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$5.293

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Microchip USA

USA . 171 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,016 parts In-Stock

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Corohmni

South Africa . 361 parts In-Stock

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Ampacity Inc.

Singapore . 1,548 parts In-Stock

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One Stop Electronics

USA . 506 parts In-Stock

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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Continental Prestige Electronics

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Argo Parts USA

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Aranea Global

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Corphita

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UNI Independent Distributors

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Perfect Parts

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Overview

Discover the unparalleled quality and reliability of the TJA1020T/N1,112 by NXP Semiconductors, known for their cutting-edge technology and innovation. This network interface device offers seamless connectivity and superior performance in various applications, making it an essential component for your electronic projects. With a compact design and durable construction, this product ensures long-lasting efficiency and functionality. Experience the value and benefits of the TJA1020T/N1,112 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to heat, making this product suitable for long-term use.

Surface Mount: YES

Surface mount design allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 8

Having 8 terminals provides versatility in connectivity options, allowing for multiple connections to other devices.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of Nickel Palladium Gold terminal finish ensures reliable electrical connections and corrosion resistance, leading to stable performance over time.

Maximum Seated Height: 1.75 mm

Low seated height of 1.75 mm saves space on the circuit board, making it suitable for compact electronic devices.

Nominal Supply Voltage: 12 V

Operating at a nominal supply voltage of 12 V provides compatibility with standard power sources, making integration easier.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product offers fine spacing for connections, allowing for high-density mounting on PCBs.

Technical Specifications

Network Interfaces TJA1020T/N1,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1020T/N1,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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