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TEF6730HW

NXP Semiconductors

TEF6730HW by NXP Semiconductors

TEF6730HW by NXP Semiconductors is a versatile audio tuner IC designed for industrial applications. It features a built-in IF amplifier, operates b/w 65-108 MHz, and supports temperatures from -40 °C to 85 °C. Its compact flatpack design ensures efficient surface mounting in various devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 1,498 parts In-Stock

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Atlantic Semiconductor

USA . 1,498 parts In-Stock

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Anansix

USA . 1,479 parts In-Stock

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1,479

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Digiode

USA . 264 parts In-Stock

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264

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Vyrian

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168

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One Stop Electronics

USA . 589 parts In-Stock

1+ parts

$10.800

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589

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Kepictronics

USA . 13,000 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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UNI Independent Distributors

Spain . 1,745 parts In-Stock

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Corphita

USA . 1,707 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Elevate your audio experience with the TEF6730HW from NXP Semiconductors—your premier choice for Silicon Tuner ICs. Renowned for their cutting-edge technology and reliability, NXP delivers exceptional performance that seamlessly integrates into various applications, from commercial audio systems to automotive solutions. Enjoy superior sound quality, enhanced signal reception, and robust durability, all while benefiting from NXP's commitment to innovation and excellence. Unlock endless possibilities with TEF6730HW!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Built-in IF Amplifier: YES

Having a built-in IF amplifier enhances the IC's performance by improving signal strength and ensuring better sound quality.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, saving space on printed circuit boards.

Package Shape: SQUARE

The square package shape aids in consistent thermal and electrical performance, facilitating uniform assembly in devices.

General IC Type: AUDIO TUNER

As an audio tuner, this IC is specifically designed for high-quality audio applications, ensuring optimal performance in sound systems.

Minimum Input Frequency (RF): 65 MHz

This low minimum input frequency allows the tuner to effectively capture a broad range of audio signals, including those from low-frequency sources.

No. of Terminals: 64

A high number of terminals facilitates versatile connections and integration into complex circuit designs, enhancing functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This specific package style supports efficient heat dissipation and allows for dense packing on PCBs, ideal for modern electronics.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is reliable in a variety of temperature-sensitive applications.

No. of Bands: 2

Supporting two bands allows for flexible tuning options, accommodating more audio frequencies and improving user experience.

Minimum Operating Temperature: -40 °C

This wide operating temperature range allows the IC to function effectively in extreme environments, making it suitable for industrial applications.

Terminal Position: QUAD

The quad terminal position facilitates efficient circuit layout and connectivity, minimizing signal loss in the design.

Maximum Seated Height: 1.2 mm

A low seated height allows for integration into thin devices, thus enhancing device portability and compactness.

Width: 10 mm

The compact width aids in space-saving designs, crucial for modern electronics where miniaturization is important.

Minimum Supply Voltage (Vsup): 8 V

A minimum supply voltage of 8V ensures compatibility with a variety of power sources, allowing for diverse applications.

Nominal Noise Figure: 3.5 dB

A low nominal noise figure indicates high signal quality, making it an excellent choice for audio applications where clarity is critical.

Length: 10 mm

The length complements the width to maintain a compact size, making it easier to fit into smaller electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies robustness and reliability, ensuring the IC can withstand harsh industrial environments.

Terminal Form: GULL WING

The gull wing terminal form is designed for optimal soldering, ensuring strong connections and durability under operational stresses.

Maximum Input Frequency (RF): 108 MHz

The ability to handle up to 108 MHz makes this tuner capable of receiving a wide range of audio signals, thus ensuring versatile functionality.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for higher-density PCB layouts, which is beneficial in modern electronics that prioritize space efficiency.

Maximum Supply Voltage (Vsup): 9 V

A maximum supply voltage of 9V allows flexibility in power supply options, making it adaptable for various applications.

Technical Specifications

Silicon Tuner ICs TEF6730HW attributes and parameters. Explore more Silicon Tuner ICs devices from NXP Semiconductors

Specs

Built-in IF Amplifier (IF):

YES

General IC Type:

Maximum Input Frequency (RF):

108 MHz

Minimum Input Frequency (RF):

65 MHz

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Nominal Noise Figure:

3.5 dB

No. of Bands:

2

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TEF6730HW General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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