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TEA1733P/N1,112

NXP Semiconductors

TEA1733P/N1,112 by NXP Semiconductors

TEA1733P/N1,112 by NXP Semiconductors is a current-mode switching controller with a max input voltage of 30V and nominal output of 10.5V. It features an 8-terminal in-line package and operates at a max frequency of 71kHz. Ideal for efficient power regulation in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,666 parts In-Stock

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Digiode

USA . 4,091 parts In-Stock

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Anansix

USA . 552 parts In-Stock

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Microchip USA

USA . 233 parts In-Stock

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$0.594

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One Stop Electronics

USA . 1,393 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 1,052 parts In-Stock

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$13.460

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Component Stockers USA

USA . 401 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 26,502 parts In-Stock

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UNI Independent Distributors

Spain . 6,639 parts In-Stock

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Corphita

USA . 4,382 parts In-Stock

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Overview

Elevate your power management solutions with the TEA1733P/N1,112 from NXP Semiconductors. Renowned for exceptional quality and reliability, this switching regulator empowers applications across diverse sectors, ensuring efficient energy conversion with minimal loss. Its user-friendly design and robust performance enable seamless integration, making it a smart choice for engineers seeking reliability without compromise. Experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Robust plastic/epoxy construction ensures durability and longevity in various operating environments.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient PCB layout and utilization of space.

No. of Terminals: 8

Eight terminals provide flexible connection options, enhancing compatibility with different circuit designs.

Package Style (Meter): IN-LINE

In-line package style simplifies integration into existing systems and designs, facilitating easier installation.

Control Mode: CURRENT-MODE

Current-mode control offers improved transient response and stability, making it ideal for dynamic load conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position offers versatility in layout design and easier routing on the PCB.

Maximum Seated Height: 4.2 mm

A compact height allows for use in low-profile applications without compromising performance.

Width: 7.62 mm

Narrow width helps conserve space on the PCB, making it suitable for compact designs.

Other IC type: SWITCHING CONTROLLER

Utilizing a switching controller significantly increases efficiency and reduces heat generation compared to linear regulators.

Nominal Input Voltage: 20 V

A nominal input voltage of 20 V provides a strong operating range for various applications.

Length: 9.5 mm

The length is optimized for standard layouts, aiding in compact and efficient circuit design.

Maximum Switching Frequency: 71 kHz

Higher switching frequency allows for smaller external components, leading to a more compact solution.

Terminal Form: THROUGH-HOLE

Through-hole mounting enhances mechanical stability and reliability, especially in high-vibration environments.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation provides precise control of output voltage and current, improving overall performance and efficiency.

Switcher Config: SINGLE

Single switcher configuration is ideal for many applications, simplifying design and implementation.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm ensures compatibility with a wide range of PCB designs and components.

Minimum Input Voltage: 12 V

A minimum input voltage of 12 V allows for a variety of applications, including battery-operated devices.

Nominal Output Voltage: 10.5 V

A nominal output voltage of 10.5 V is suitable for powering common electronic components and systems.

Maximum Input Voltage: 30 V

High maximum input voltage offers flexibility in power supply design, accommodating a range of systems.

Technical Specifications

Switching Regulators & Controllers TEA1733P/N1,112 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

30 V

Minimum Input Voltage:

12 V

Nominal Input Voltage:

20 V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Nominal Output Voltage:

10.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

71 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

TEA1733P/N1,112 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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