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TEA1721AT/N1

NXP Semiconductors

TEA1721AT/N1 by NXP Semiconductors

TEA1721AT/N1 by NXP Semiconductors is a switching controller with max. operating temp of 85°C and min. operating temp of -40°C. It has a max. input voltage of 20V and max. switching frequency of 50.5 kHz, making it ideal for industrial applications requiring precise current/voltage-mode control in compact designs.

Median Price

$1.201

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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RS (Exports)

UK . 2,520 parts In-Stock

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$1.201

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$1.150

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2,520

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$1.150

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Distributors (In-Stock)

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Vyrian

USA . 2,022 parts In-Stock

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Digiode

USA . 699 parts In-Stock

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699

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Anansix

USA . 293 parts In-Stock

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Ampacity Inc.

Singapore . 2,357 parts In-Stock

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$1.020

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$1.020

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Aztec Data Supply Inc.

USA . 3,901 parts In-Stock

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$14.345

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$14.345

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Corohmni

South Africa . 877 parts In-Stock

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$18.946

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877

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Lixinc

USA . 18,227 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 7,525 parts In-Stock

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Argo Parts USA

USA . 3,926 parts In-Stock

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Continental Prestige Electronics

USA . 2,431 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 1,737 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Discover the TEA1721AT/N1 by NXP Semiconductors, a cutting-edge switching regulator designed to deliver exceptional performance and reliability. With its innovative design and high-quality materials, this product stands out in the Switching Regulators & Controllers category. From industrial applications to consumer electronics, the TEA1721AT/N1 is versatile and efficient, providing customers with unmatched value and benefits. Trust NXP Semiconductors for superior technology that meets your needs and exceeds your expectations. Elevate your designs with the TEA1721AT/N1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and lightweight design for the product.

Surface Mount: YES

Enables easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

Facilitates space-saving design for compact electronic devices.

No. of Terminals: 7

Sufficient terminals for connectivity and functionality.

Control Mode: CURRENT/VOLTAGE-MODE

Offers flexibility in controlling current and voltage for different applications.

Maximum Operating Temperature: 85 °C

Ensures stable performance in varying temperature conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range makes it suitable for different environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and improved conductivity for terminals.

Maximum Switching Frequency: 50.5 kHz

High switching frequency allows for efficient power conversion.

Technical Specifications

Switching Regulators & Controllers TEA1721AT/N1 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Nominal Input Voltage:

20 V

JESD-30 Code:

R-PDSO-G7

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Maximum Switching Frequency:

50.5 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TEA1721AT/N1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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