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TEA1733CT/N1,118

NXP Semiconductors

TEA1733CT/N1,118 by NXP Semiconductors

TEA1733CT/N1,118 by NXP Semiconductors is a compact switching regulator designed for efficient power management. It features a max switching frequency of 71 kHz, operates in current-mode control, and comes in an 8-terminal gull-wing package. Ideal for applications requiring reliable voltage regulation in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,459 parts In-Stock

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Digiode

USA . 2,244 parts In-Stock

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Anansix

USA . 1,618 parts In-Stock

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One Stop Electronics

USA . 836 parts In-Stock

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$1.500

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836

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$12.886

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$11.726

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$10.567

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150

$12.886

$11.726

$10.567

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AZTECH Wire

Italy . 256 parts In-Stock

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$22.030

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256

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UNI Independent Distributors

Spain . 4,148 parts In-Stock

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Corphita

USA . 3,718 parts In-Stock

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Microchip USA

USA . 3,274 parts In-Stock

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Overview

Unlock the power of efficiency with the TEA1733CT/N1,118 from NXP Semiconductors! Renowned for their commitment to quality and innovation, NXP delivers a top-tier switching regulator designed to optimize your applications. This sleek, dual-terminal solution offers reliable performance that enhances energy savings and reduces costs, making it ideal for a variety of uses. Elevate your projects with cutting-edge technology and enjoy peace of mind knowing you chose excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, ensuring reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact design, making it ideal for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and integration into circuit boards, optimizing space and functionality.

No. of Terminals: 8

Having 8 terminals allows for versatile connections and simplifies circuit design, enhancing connectivity options.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a minimal footprint on PCB, supporting high-density designs.

Control Mode: CURRENT-MODE

The current-mode control enhances response to load changes, resulting in improved stability and performance.

Terminal Position: DUAL

Dual terminal positions provide options for layout flexibility and can contribute to better thermal management.

Peak Reflow Temperature °C: 260

This high peak reflow temperature indicates compatibility with modern soldering processes, improving manufacturability.

Maximum Switching Frequency: 71 kHz

A maximum switching frequency of 71 kHz indicates efficient operation, allowing for smaller inductors and capacitors.

Terminal Form: GULL WING

Gull wing terminals contribute to ease of soldering and provide good mechanical stability on the PCB.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch supports compatibility with various PCB designs, ensuring widespread usability.

Technical Specifications

Switching Regulators & Controllers TEA1733CT/N1,118 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

71 kHz

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TEA1733CT/N1,118 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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