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TEA1721DT/N1,118

NXP Semiconductors

TEA1721DT/N1,118 by NXP Semiconductors

TEA1721DT/N1,118 by NXP Semiconductors is a versatile switching regulator designed for industrial applications. It operates b/w -40 °C to 85 °C with a max switching frequency of 53 kHz and features a compact 7-terminal gull-wing package. Ideal for efficient power management in various electronic devices.

Median Price

$0.748

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10,000 parts In-Stock

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$0.616

10,000

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$0.616

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.879

1k+ parts

$0.729

10k+ parts

$0.650

2,500

-

$0.879

$0.729

$0.650

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,342 parts In-Stock

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7,342

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Digiode

USA . 978 parts In-Stock

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978

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Anansix

USA . 652 parts In-Stock

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652

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Cogito LLC

Ukraine . 44 parts In-Stock

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44

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Distributors (Availability)

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One Stop Electronics

USA . 1,164 parts In-Stock

1+ parts

$2.500

100+ parts

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1,164

$2.500

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Microchip USA

USA . 4,978 parts In-Stock

1+ parts

$4.043

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4,978

$4.043

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AZTECH Wire

Italy . 299 parts In-Stock

1+ parts

$14.600

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299

$14.600

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Perfect Parts

USA . 5,600 parts In-Stock

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5,600

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Corphita

USA . 2,666 parts In-Stock

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2,666

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QUARKTWIN TECHNOLOGY LTD

USA . 2,266 parts In-Stock

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UNI Independent Distributors

Spain . 2,139 parts In-Stock

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2,139

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Unlock the potential of your designs with the TEA1721DT/N1,118 from NXP Semiconductors—a leader in innovation and quality. This versatile switching regulator promises exceptional efficiency and reliability for a range of applications, from industrial control to consumer electronics. With its robust temperature range and compact footprint, it’s engineered to enhance performance while reducing space. Elevate your projects with NXP’s trusted technology—where quality meets value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures long-lasting protection and reliability, making this regulator suitable for demanding applications.

Surface Mount: YES

Being surface mount compatible allows for compact designs and efficient use of PCB space, which is essential in modern electronic applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout flexibility on printed circuit boards, optimizing space and performance.

No. of Terminals: 7

The seven terminals provide enhanced connection options, facilitating more complex circuit designs and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline style makes this regulator easy to integrate into space-constrained designs, which is vital for portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in warm environments, making this product suitable for industrial applications.

Control Mode: CURRENT/VOLTAGE-MODE

The dual control mode enhances flexibility, providing better performance across a wide range of applications whether constant current or constant voltage regulation is needed.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures functionality in extreme conditions, ideal for outdoor and harsh environments.

Terminal Position: DUAL

The dual terminal position accommodates various design layouts, making it versatile for diverse circuit configurations.

Peak Reflow Temperature °C: 260 °C

The high peak reflow temperature capability ensures compatibility with high-temperature soldering processes, enhancing manufacturability.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies reliability and robustness, ensuring the product meets demanding industrial standards.

Maximum Switching Frequency: 53 kHz

A maximum switching frequency of 53 kHz allows for efficient power conversion while minimizing energy losses, resulting in improved performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering, making assembly more efficient.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for high-density packaging, supporting compact circuit designs without sacrificing performance.

Technical Specifications

Switching Regulators & Controllers TEA1721DT/N1,118 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Control Mode:

CURRENT/VOLTAGE-MODE

JESD-30 Code:

R-PDSO-G7

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

7

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP7/8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

53 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TEA1721DT/N1,118 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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